EP2SGX30DF780I3N vs EP2SGX30DF780I5N 比較

詳細並排比較 EP2SGX30DF780I3N 由 Intel 與 EP2SGX30DF780I5N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP2SGX30DF780I3N EP2SGX30DF780I5N
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 NRND NRND
Family Stratix II GX Stratix II GX
Logic Elements 33,880 —
Logic Cells 33,380 33,880 (33,380 logic elements)
Configurable Logic Blocks (CLBs) 33,880 —
Total Memory Bits 1,369,728 —
Maximum Core Frequency 622.08 MHz —
Process Technology 90 nm CMOS 90 nm CMOS
Core Supply Voltage 1.2 V —
User I/O Pins 361 —
封裝 780-ball FBGA (Fine-Pitch BGA), 29 x 29 mm, 1 mm pitch —
安裝類型 Surface Mount Surface Mount
Operating Temperature Grade Industrial —
Lead Free Yes —
RoHS 狀態 Compliant —
Speed Grade I3 I5
Logic Array Blocks (LABs) — 33,880
Core Voltage — 1.2 V
Internal Clock Frequency (max) — 622.08 MHz
Number of Transceivers — [DATA_NEEDED: transceiver count]
Number of Pins / Balls — 780
Package Type — FC-FBGA-780 (Flip-Chip Fine-pitch BGA)
Package Size — 29 x 29 mm, 1.0 mm pitch
工作溫度 — -40C to +85C (Industrial)
Lead-Free / RoHS — Lead Free (per Kynix listing)
Temperature Grade Suffix — Industrial

資料表與資源

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