EP2SGX30DF780I3N vs EP2SGX30DF780I5N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX30DF780I3N sa pamamagitan ng Intel at EP2SGX30DF780I5N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP2SGX30DF780I3N EP2SGX30DF780I5N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND NRND
Family Stratix II GX Stratix II GX
Logic Elements 33,880 —
Logic Cells 33,380 33,880 (33,380 logic elements)
Configurable Logic Blocks (CLBs) 33,880 —
Total Memory Bits 1,369,728 —
Maximum Core Frequency 622.08 MHz —
Process Technology 90 nm CMOS 90 nm CMOS
Core Supply Voltage 1.2 V —
User I/O Pins 361 —
Packhaging 780-ball FBGA (Fine-Pitch BGA), 29 x 29 mm, 1 mm pitch —
Uri ng Pagpapasok Surface Mount Surface Mount
Operating Temperature Grade Industrial —
Lead Free Yes —
Tindminan RoHS Compliant —
Speed Grade I3 I5
Logic Array Blocks (LABs) — 33,880
Core Voltage — 1.2 V
Internal Clock Frequency (max) — 622.08 MHz
Number of Transceivers — [DATA_NEEDED: transceiver count]
Number of Pins / Balls — 780
Package Type — FC-FBGA-780 (Flip-Chip Fine-pitch BGA)
Package Size — 29 x 29 mm, 1.0 mm pitch
Temperature na Operasyon — -40C to +85C (Industrial)
Lead-Free / RoHS — Lead Free (per Kynix listing)
Temperature Grade Suffix — Industrial

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