EP3SE260F1152I3 vs EP3SE260F1152C4N Perbandingan
Perbandingan bersamaan detil EP3SE260F1152I3 dari Intel dan EP3SE260F1152C4N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3SE260F1152I3 | EP3SE260F1152C4N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Obsolete |
| Series | Stratix III E (EP3SE260) | Stratix III E |
| Logic Elements | 255,000 | — |
| Number of LABs/CLBs | 10,200 | 10,200 |
| Total RAM Bits | 16,672,768 | — |
| User I/O Count | 744 | — |
| Number of Embedded Multipliers (DSP blocks) | 768 | — |
| Core Voltage | 1.1 V | 1.1 V |
| Suhu Kerja | -40C to +100C (Industrial) | 0C to +85C (commercial, 'C' suffix) |
| Process Technology | 65 nm | 65 nm CMOS |
| Maximum Fabric Frequency | 500 MHz | — |
| Paket | 1152-BBGA, FC-FBGA (Flip-Chip) | 1152-ball FC-FBGA (flip-chip) |
| Tipe Mounting | Surface Mount | Surface Mount (BGA) |
| Speed Grade | I3 (Industrial, speed bin 3) | -4 (commercial temperature) |
| Level MSL | [DATA_NEEDED: MSL level] | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | — |
| Product Status | Obsolete (per Xecor comparator) | Obsolete (per Xecor cross-reference data) |
| Family | — | Stratix III (Enhanced) |
| Logic Elements (LEs) | — | 255,000 |
| Embedded Memory | — | 16,672,768 bits (16.67 Mbit) |
| Maximum User I/Os | — | 744 |
| DSP / 18x18 Multipliers | — | 768 embedded multipliers |
| Maximum Operating Frequency | — | 450 MHz |
| Packaging | — | Tray |
| Lead-Free / RoHS | — | Lead-free finish (RoHS compliant per distributor listing) |
| Tipe Memori | — | SRAM-based, volatile (requires configuration device) |
| Configuration | — | External EPCS / enhanced configuration via AS, PS, JTAG, or FPP |