EP3SE260F1152I3 vs EP3SE260F1152C4N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1152I3 sa pamamagitan ng Intel at EP3SE260F1152C4N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SE260F1152I3 | EP3SE260F1152C4N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Series | Stratix III E (EP3SE260) | Stratix III E |
| Logic Elements | 255,000 | — |
| Number of LABs/CLBs | 10,200 | 10,200 |
| Total RAM Bits | 16,672,768 | — |
| User I/O Count | 744 | — |
| Number of Embedded Multipliers (DSP blocks) | 768 | — |
| Core Voltage | 1.1 V | 1.1 V |
| Temperature na Operasyon | -40C to +100C (Industrial) | 0C to +85C (commercial, 'C' suffix) |
| Process Technology | 65 nm | 65 nm CMOS |
| Maximum Fabric Frequency | 500 MHz | — |
| Packhaging | 1152-BBGA, FC-FBGA (Flip-Chip) | 1152-ball FC-FBGA (flip-chip) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Speed Grade | I3 (Industrial, speed bin 3) | -4 (commercial temperature) |
| Level ng MSL | [DATA_NEEDED: MSL level] | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | — |
| Product Status | Obsolete (per Xecor comparator) | Obsolete (per Xecor cross-reference data) |
| Family | — | Stratix III (Enhanced) |
| Logic Elements (LEs) | — | 255,000 |
| Embedded Memory | — | 16,672,768 bits (16.67 Mbit) |
| Maximum User I/Os | — | 744 |
| DSP / 18x18 Multipliers | — | 768 embedded multipliers |
| Maximum Operating Frequency | — | 450 MHz |
| Packaging | — | Tray |
| Lead-Free / RoHS | — | Lead-free finish (RoHS compliant per distributor listing) |
| Uri ng Memory | — | SRAM-based, volatile (requires configuration device) |
| Configuration | — | External EPCS / enhanced configuration via AS, PS, JTAG, or FPP |