EP3SE260F1152I3 vs EP3SE260F1152C4N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE260F1152I3 disebabkan oleh Intel dan EP3SE260F1152C4N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3SE260F1152I3 | EP3SE260F1152C4N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Obsolete |
| Series | Stratix III E (EP3SE260) | Stratix III E |
| Logic Elements | 255,000 | — |
| Number of LABs/CLBs | 10,200 | 10,200 |
| Total RAM Bits | 16,672,768 | — |
| User I/O Count | 744 | — |
| Number of Embedded Multipliers (DSP blocks) | 768 | — |
| Core Voltage | 1.1 V | 1.1 V |
| Suhu Operasi | -40C to +100C (Industrial) | 0C to +85C (commercial, 'C' suffix) |
| Process Technology | 65 nm | 65 nm CMOS |
| Maximum Fabric Frequency | 500 MHz | — |
| Kemasan | 1152-BBGA, FC-FBGA (Flip-Chip) | 1152-ball FC-FBGA (flip-chip) |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Speed Grade | I3 (Industrial, speed bin 3) | -4 (commercial temperature) |
| Aras MSL | [DATA_NEEDED: MSL level] | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | — |
| Product Status | Obsolete (per Xecor comparator) | Obsolete (per Xecor cross-reference data) |
| Family | — | Stratix III (Enhanced) |
| Logic Elements (LEs) | — | 255,000 |
| Embedded Memory | — | 16,672,768 bits (16.67 Mbit) |
| Maximum User I/Os | — | 744 |
| DSP / 18x18 Multipliers | — | 768 embedded multipliers |
| Maximum Operating Frequency | — | 450 MHz |
| Packaging | — | Tray |
| Lead-Free / RoHS | — | Lead-free finish (RoHS compliant per distributor listing) |
| Jenis Ingatan | — | SRAM-based, volatile (requires configuration device) |
| Configuration | — | External EPCS / enhanced configuration via AS, PS, JTAG, or FPP |