EP3SE260F1517I4N vs EP3SE260F1517C4N Perbandingan
Perbandingan bersamaan detil EP3SE260F1517I4N dari Intel dan EP3SE260F1517C4N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
EP3SE260F1517I4N - Stratix III E FPGA, 255K LE, 1517-BGA | Intel
EP3SE260F1517I4N ⚠ Waktu Beli Terakhir
Perbandingan Spesifikasi
| Parameter Umum | EP3SE260F1517I4N | EP3SE260F1517C4N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Waktu Pembelian Terakhir | NRND |
| Series | Stratix III E | Stratix® III E |
| Logic Elements | 255,000 | 255,000 |
| Embedded Memory Bits | 16,672,768 bits | — |
| Embedded Memory (M9K/M144K blocks) | [DATA_NEEDED: total Kbits and block count] | — |
| User I/O Pins | 976 | — |
| Transceivers | [DATA_NEEDED: number of full-duplex channels] | — |
| Transceiver Data Rate | 600 Mbps to 6.375 Gbps | — |
| DSP Blocks | [DATA_NEEDED: number of 18x18 multipliers] | — |
| PLLs | [DATA_NEEDED: total PLL count] | — |
| Core Voltage | 1.1 V | 0.9 V |
| Process Technology | TSMC 65 nm | — |
| Paket | 1517-BBGA, FCBGA | 1517-BBGA, FCBGA |
| Package Body Size | [DATA_NEEDED: mm x mm] | — |
| Suhu Kerja | -40 °C to +100 °C (Industrial) | 0°C to 85°C |
| Operating Temperature Grade | Industrial (I4) | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Lead-Free / RoHS | [DATA_NEEDED: explicit RoHS statement] | — |
| Level MSL | [DATA_NEEDED: MSL classification] | [DATA_NEEDED: MSL level] |
| Family | — | Field-Programmable Gate Array (FPGA) |
| Embedded Memory | — | 16,672,768 bits |
| Logic Array Blocks (LABs) | — | 10,200 |
| Maximum User I/Os | — | 976 |
| Process Node | — | 65 nm |
| Lead Free | — | [DATA_NEEDED: lead-free status] |
| Status RoHS | — | [DATA_NEEDED: RoHS status] |
| Maximum Transceiver Data Rate | — | 12.5 Gbps |