EP3SE260H780C3 vs EP3SE260H780C3N Perbandingan

Perbandingan bersamaan detil EP3SE260H780C3 dari Intel dan EP3SE260H780C3N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum EP3SE260H780C3 EP3SE260H780C3N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Device Family Stratix III Enhanced (Stratix III E) —
Series EP3SE Stratix® III E
Logic Elements 255,000 —
Logic Array Blocks (LABs) 10200 —
Embedded Memory 16,672,768 bits (16.67 Mbit) —
User I/Os 488 488
Operating Voltage (Core) 0.9 V —
Operating Voltage (Auxiliary) 1.1 V —
Process Technology 65 nm CMOS 40 nm CMOS
Speed Grade C3 —
Suhu Kerja Commercial, 0C to +85C 0 °C to +85 °C (C grade, commercial)
Maximum Core Frequency 500 MHz [DATA_NEEDED: maximum core frequency MHz]
Paket 780-ball FCBGA (HBGA), flip-chip 780-BBGA, FCBGA (H780)
Tipe Mounting Surface Mount (BGA) Surface Mount
Tingkat Sensitivitas Kekeringan (MSL) 3 (168 hours) [DATA_NEEDED: MSL level per JEDEC J-STD-020]
Packaging Type Tray —
Configuration Memory Support Fast passive parallel, JTAG, Active Serial —
Status RoHS Compliant (per product listings) Compliant (lead-free 'N' suffix)
Logic Elements (LE) — 255,000
Embedded Memory (bits) — 16,672,768
Number of LABs/CLBs — 10,200
Number of Pins / Balls — 780
Supply Voltage (VCCINT) — [DATA_NEEDED: VCCINT nominal V]
Transceivers — [DATA_NEEDED: number of embedded transceivers and max data rate]
DSP Blocks — [DATA_NEEDED: number of DSP blocks and precision]
Configuration Method — SRAM-based, configured via JTAG / passive / active serial / fast passive parallel
Design Toolchain — Altera Quartus II (legacy); Intel Quartus Prime

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