EP3SE260H780C3 vs EP3SE260H780C3N 比較
詳細並排比較 EP3SE260H780C3 由 Intel 與 EP3SE260H780C3N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP3SE260H780C3 | EP3SE260H780C3N |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Device Family | Stratix III Enhanced (Stratix III E) | — |
| Series | EP3SE | Stratix® III E |
| Logic Elements | 255,000 | — |
| Logic Array Blocks (LABs) | 10200 | — |
| Embedded Memory | 16,672,768 bits (16.67 Mbit) | — |
| User I/Os | 488 | 488 |
| Operating Voltage (Core) | 0.9 V | — |
| Operating Voltage (Auxiliary) | 1.1 V | — |
| Process Technology | 65 nm CMOS | 40 nm CMOS |
| Speed Grade | C3 | — |
| 工作溫度 | Commercial, 0C to +85C | 0 °C to +85 °C (C grade, commercial) |
| Maximum Core Frequency | 500 MHz | [DATA_NEEDED: maximum core frequency MHz] |
| 封裝 | 780-ball FCBGA (HBGA), flip-chip | 780-BBGA, FCBGA (H780) |
| 安裝類型 | Surface Mount (BGA) | Surface Mount |
| 濕度敏感等級 (MSL) | 3 (168 hours) | [DATA_NEEDED: MSL level per JEDEC J-STD-020] |
| Packaging Type | Tray | — |
| Configuration Memory Support | Fast passive parallel, JTAG, Active Serial | — |
| RoHS 狀態 | Compliant (per product listings) | Compliant (lead-free 'N' suffix) |
| Logic Elements (LE) | — | 255,000 |
| Embedded Memory (bits) | — | 16,672,768 |
| Number of LABs/CLBs | — | 10,200 |
| Number of Pins / Balls | — | 780 |
| Supply Voltage (VCCINT) | — | [DATA_NEEDED: VCCINT nominal V] |
| Transceivers | — | [DATA_NEEDED: number of embedded transceivers and max data rate] |
| DSP Blocks | — | [DATA_NEEDED: number of DSP blocks and precision] |
| Configuration Method | — | SRAM-based, configured via JTAG / passive / active serial / fast passive parallel |
| Design Toolchain | — | Altera Quartus II (legacy); Intel Quartus Prime |