EP3SE260H780C4N vs EP3SE260H780C3N Perbandingan

Perbandingan bersamaan detil EP3SE260H780C4N dari Intel dan EP3SE260H780C3N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum EP3SE260H780C4N EP3SE260H780C3N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup NRND Aktif
Family Stratix III E (Enhanced) —
Logic Elements 255,000 —
Logic Array Blocks (LABs) 10,200 —
Total RAM Bits 16,672,768 —
Embedded Memory M9K and M144K blocks —
User I/O Pins 488 —
DSP Blocks (18x18 Multipliers) 768 —
PLLs 12 —
Process Node 65 nm CMOS —
Core Voltage 0.86 V to 1.15 V —
Maximum Core Clock Frequency 450 MHz —
Paket 780-ball FCBGA (Flip Chip BGA) 780-BBGA, FCBGA (H780)
Tipe Mounting Surface Mount Surface Mount
Tingkat Sensitivitas Kekeringan (MSL) 3 (168 hours) [DATA_NEEDED: MSL level per JEDEC J-STD-020]
Suhu Kerja 0C to +85C (commercial) 0 °C to +85 °C (C grade, commercial)
Configuration Method Serial/Parallel via Quartus II SRAM-based, configured via JTAG / passive / active serial / fast passive parallel
Series — Stratix® III E
Logic Elements (LE) — 255,000
Embedded Memory (bits) — 16,672,768
Number of LABs/CLBs — 10,200
User I/Os — 488
Number of Pins / Balls — 780
Process Technology — 40 nm CMOS
Maximum Core Frequency — [DATA_NEEDED: maximum core frequency MHz]
Supply Voltage (VCCINT) — [DATA_NEEDED: VCCINT nominal V]
Transceivers — [DATA_NEEDED: number of embedded transceivers and max data rate]
DSP Blocks — [DATA_NEEDED: number of DSP blocks and precision]
Status RoHS — Compliant (lead-free 'N' suffix)
Design Toolchain — Altera Quartus II (legacy); Intel Quartus Prime

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