EP3SE260H780C4N vs EP3SE260H780C4L Perbandingan
Perbandingan bersamaan detil EP3SE260H780C4N dari Intel dan EP3SE260H780C4L dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3SE260H780C4N | EP3SE260H780C4L |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Family | Stratix III E (Enhanced) | Stratix III E |
| Logic Elements | 255,000 | 255,000 |
| Logic Array Blocks (LABs) | 10,200 | — |
| Total RAM Bits | 16,672,768 | 16,672,768 (16.7 Mbit) |
| Embedded Memory | M9K and M144K blocks | — |
| User I/O Pins | 488 | — |
| DSP Blocks (18x18 Multipliers) | 768 | — |
| PLLs | 12 | — |
| Process Node | 65 nm CMOS | — |
| Core Voltage | 0.86 V to 1.15 V | 0.9 V (nominal) |
| Maximum Core Clock Frequency | 450 MHz | — |
| Paket | 780-ball FCBGA (Flip Chip BGA) | 780-ball FCBGA (HBGA 33x33 mm) |
| Tipe Mounting | Surface Mount | Surface Mount (flip-chip BGA) |
| Tingkat Sensitivitas Kekeringan (MSL) | 3 (168 hours) | — |
| Suhu Kerja | 0C to +85C (commercial) | — |
| Configuration Method | Serial/Parallel via Quartus II | — |
| LABs/CLBs | — | 10,200 |
| User I/O Count | — | 488 |
| Speed Grade | — | C4 (middle/slow tier) |
| Suhu Hubung Kerja | — | 0C to +85C (commercial) |
| Level MSL | — | [DATA_NEEDED: MSL level] |
| Status RoHS | — | Compliant (lead-free per datasheet) |
| Transceivers | — | Up to 24 multi-gigabit transceivers |
| Memory Interface | — | DDR3, DDR2, QDRII+, RLDRAM II controllers |
| Configuration Mode | — | PS, FPP, JTAG with EPCS/EPCQ |