EP3SE260H780C4N vs EP3SE260H780C4L Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260H780C4N sa pamamagitan ng Intel at EP3SE260H780C4L sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SE260H780C4N | EP3SE260H780C4L |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Family | Stratix III E (Enhanced) | Stratix III E |
| Logic Elements | 255,000 | 255,000 |
| Logic Array Blocks (LABs) | 10,200 | — |
| Total RAM Bits | 16,672,768 | 16,672,768 (16.7 Mbit) |
| Embedded Memory | M9K and M144K blocks | — |
| User I/O Pins | 488 | — |
| DSP Blocks (18x18 Multipliers) | 768 | — |
| PLLs | 12 | — |
| Process Node | 65 nm CMOS | — |
| Core Voltage | 0.86 V to 1.15 V | 0.9 V (nominal) |
| Maximum Core Clock Frequency | 450 MHz | — |
| Packhaging | 780-ball FCBGA (Flip Chip BGA) | 780-ball FCBGA (HBGA 33x33 mm) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (flip-chip BGA) |
| Level ng Sensitivity sa Asid ng Moisture (MSL) | 3 (168 hours) | — |
| Temperature na Operasyon | 0C to +85C (commercial) | — |
| Configuration Method | Serial/Parallel via Quartus II | — |
| LABs/CLBs | — | 10,200 |
| User I/O Count | — | 488 |
| Speed Grade | — | C4 (middle/slow tier) |
| Temperature ng Junction na Operasyon | — | 0C to +85C (commercial) |
| Level ng MSL | — | [DATA_NEEDED: MSL level] |
| Tindminan RoHS | — | Compliant (lead-free per datasheet) |
| Transceivers | — | Up to 24 multi-gigabit transceivers |
| Memory Interface | — | DDR3, DDR2, QDRII+, RLDRAM II controllers |
| Configuration Mode | — | PS, FPP, JTAG with EPCS/EPCQ |