EP3SE260H780C4N vs EP3SE260H780C4L Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE260H780C4N disebabkan oleh Intel dan EP3SE260H780C4L disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3SE260H780C4N | EP3SE260H780C4L |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Family | Stratix III E (Enhanced) | Stratix III E |
| Logic Elements | 255,000 | 255,000 |
| Logic Array Blocks (LABs) | 10,200 | — |
| Total RAM Bits | 16,672,768 | 16,672,768 (16.7 Mbit) |
| Embedded Memory | M9K and M144K blocks | — |
| User I/O Pins | 488 | — |
| DSP Blocks (18x18 Multipliers) | 768 | — |
| PLLs | 12 | — |
| Process Node | 65 nm CMOS | — |
| Core Voltage | 0.86 V to 1.15 V | 0.9 V (nominal) |
| Maximum Core Clock Frequency | 450 MHz | — |
| Kemasan | 780-ball FCBGA (Flip Chip BGA) | 780-ball FCBGA (HBGA 33x33 mm) |
| Jenis Pemasangan | Surface Mount | Surface Mount (flip-chip BGA) |
| Tingkat sensitiviti Air Nama (MSL) | 3 (168 hours) | — |
| Suhu Operasi | 0C to +85C (commercial) | — |
| Configuration Method | Serial/Parallel via Quartus II | — |
| LABs/CLBs | — | 10,200 |
| User I/O Count | — | 488 |
| Speed Grade | — | C4 (middle/slow tier) |
| Suhu Hubungan Operasi | — | 0C to +85C (commercial) |
| Aras MSL | — | [DATA_NEEDED: MSL level] |
| Status RoHS | — | Compliant (lead-free per datasheet) |
| Transceivers | — | Up to 24 multi-gigabit transceivers |
| Memory Interface | — | DDR3, DDR2, QDRII+, RLDRAM II controllers |
| Configuration Mode | — | PS, FPP, JTAG with EPCS/EPCQ |