EP3SE50F484I4G vs EP3SE50F484I3N Perbandingan
Perbandingan bersamaan detil EP3SE50F484I4G dari Intel dan EP3SE50F484I3N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3SE50F484I4G | EP3SE50F484I3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Family | Stratix III E | Stratix III E |
| Logic Elements | 47,500 LE | 47,500 |
| Adaptive Logic Modules (ALMs) | 19,000 ALM | — |
| Embedded Memory | 5.49 Mbit | — |
| User I/Os | 296 I/O | — |
| Tegangan Pemuat Kerja | 1.1 V (core) | — |
| Suhu Kerja | -40C to +100C (industrial) | -40C to +100C (industrial) |
| Speed Grade | 4 | I3 (industrial, bin 3) |
| Gaya Mounting | SMD/SMT | — |
| Paket | 484-Ball FCBGA (FineLine BGA) | 484-pin FC-FBGA (flip-chip BGA) |
| Process Technology | 40 nm low-power CMOS | 65 nm |
| Status RoHS | Compliant (lead-free 'G' suffix) | — |
| Level MSL | [DATA_NEEDED: MSL level] | — |
| Transceiver Count | Up to 12 (Stratix III E family) | [DATA_NEEDED: number of embedded transceivers] |
| External Memory Support | DDR3, DDR2, QDR II/II+ | — |
| Number of LABs | — | 1,900 |
| Total Memory Bits | — | 5,760,000 |
| Maximum User I/O | — | 296 |
| Number of I/O Banks | — | [DATA_NEEDED: number of I/O banks] |
| Core Voltage VCC | — | 0.9 V |
| Auxiliary Voltage VCCAUX | — | 1.1 V |
| Maximum Internal Frequency | — | 500 MHz |
| Tipe Mounting | — | Surface Mount (BGA) |
| Lead-Free / RoHS | — | Yes (N suffix) |
| Configuration Method | — | Active serial (AS), passive serial (PS), JTAG, fast passive parallel (FPP) |
| DSP Blocks | — | [DATA_NEEDED: number of DSP blocks] |
| Embedded Multipliers (18x18) | — | [DATA_NEEDED: number of 18x18 multipliers] |