EP3SE50F484I4G vs EP3SE50F484I3N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE50F484I4G disebabkan oleh Intel dan EP3SE50F484I3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3SE50F484I4G | EP3SE50F484I3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Family | Stratix III E | Stratix III E |
| Logic Elements | 47,500 LE | 47,500 |
| Adaptive Logic Modules (ALMs) | 19,000 ALM | — |
| Embedded Memory | 5.49 Mbit | — |
| User I/Os | 296 I/O | — |
| Tegangan Pemberi Arus Operasi | 1.1 V (core) | — |
| Suhu Operasi | -40C to +100C (industrial) | -40C to +100C (industrial) |
| Speed Grade | 4 | I3 (industrial, bin 3) |
| Gaya Pemasangan | SMD/SMT | — |
| Kemasan | 484-Ball FCBGA (FineLine BGA) | 484-pin FC-FBGA (flip-chip BGA) |
| Process Technology | 40 nm low-power CMOS | 65 nm |
| Status RoHS | Compliant (lead-free 'G' suffix) | — |
| Aras MSL | [DATA_NEEDED: MSL level] | — |
| Transceiver Count | Up to 12 (Stratix III E family) | [DATA_NEEDED: number of embedded transceivers] |
| External Memory Support | DDR3, DDR2, QDR II/II+ | — |
| Number of LABs | — | 1,900 |
| Total Memory Bits | — | 5,760,000 |
| Maximum User I/O | — | 296 |
| Number of I/O Banks | — | [DATA_NEEDED: number of I/O banks] |
| Core Voltage VCC | — | 0.9 V |
| Auxiliary Voltage VCCAUX | — | 1.1 V |
| Maximum Internal Frequency | — | 500 MHz |
| Jenis Pemasangan | — | Surface Mount (BGA) |
| Lead-Free / RoHS | — | Yes (N suffix) |
| Configuration Method | — | Active serial (AS), passive serial (PS), JTAG, fast passive parallel (FPP) |
| DSP Blocks | — | [DATA_NEEDED: number of DSP blocks] |
| Embedded Multipliers (18x18) | — | [DATA_NEEDED: number of 18x18 multipliers] |