EP3SE50F780C3 vs EP3SL50F780C3 Perbandingan
Perbandingan bersamaan detil EP3SE50F780C3 dari Intel dan EP3SL50F780C3 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
EP3SL50F780C3 - Stratix III L FPGA, 47.5K LE, 780-FBGA | Intel / Altera
EP3SL50F780C3 ⚠ Waktu Beli TerakhirPerbandingan Spesifikasi
| Parameter Umum | EP3SE50F780C3 | EP3SL50F780C3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Waktu Pembelian Terakhir |
| Family | Stratix III E | Stratix III L (low-power) |
| Logic Elements (LE) | 47,500 | — |
| Embedded Memory (BRAM) | 5,760 Kbits | — |
| User I/Os | 488 | 488 |
| Paket | 780-ball FC-FBGA (FineLine BGA) | — |
| Process Technology | 65 nm | — |
| Core Voltage | 1.1 V | — |
| Logic Voltage | 0.9 V | — |
| Transceiver Speed (max) | 500 MHz | — |
| Total LABs/CLBs | 1900 | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | — |
| Number of Transceivers | [DATA_NEEDED: transceiver count] | — |
| Tipe Mounting | Surface Mount (BGA) | — |
| Suhu Kerja | 0C to +85C (Commercial grade, 'C' suffix) | 0C to +85C (Commercial) |
| Status RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Level MSL | [DATA_NEEDED: MSL level] | — |
| Series | — | Stratix III |
| Logic Elements | — | 47,500 |
| Logic Array Blocks (LABs) | — | 1,900 |
| Embedded Memory Bits | — | 2,184,192 |
| Package Type | — | 780-BBGA, FCBGA (FineLine) |
| Device Pin Count | — | 780 |
| Speed Grade | — | 3 |
| Supply Voltage (Core) | — | [DATA_NEEDED: VCCINT nominal value] |
| PLLs | — | 12 |
| Global Clock Networks | — | 24 |
| Process Node | — | 65 nm TSMC |
| Configuration Method | — | SRAM-based, supports Partial Reconfiguration |
| Lead-Free / Halogen-Free | — | Lead-Free (per package marking); Halogen-Free status unknown |
| Tingkat Sensitivitas Kekeringan (MSL) | — | MSL3 (per JEDEC J-STD-020, typical for large FBGA) |