EP3SE50F780C3 vs EP3SL50F780C3 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE50F780C3 sa pamamagitan ng Intel at EP3SL50F780C3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SE50F780C3 EP3SL50F780C3
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND Huling Pagbili
Family Stratix III E Stratix III L (low-power)
Logic Elements (LE) 47,500 —
Embedded Memory (BRAM) 5,760 Kbits —
User I/Os 488 488
Packhaging 780-ball FC-FBGA (FineLine BGA) —
Process Technology 65 nm —
Core Voltage 1.1 V —
Logic Voltage 0.9 V —
Transceiver Speed (max) 500 MHz —
Total LABs/CLBs 1900 —
DSP Blocks [DATA_NEEDED: DSP block count] —
Number of Transceivers [DATA_NEEDED: transceiver count] —
Uri ng Pagpapasok Surface Mount (BGA) —
Temperature na Operasyon 0C to +85C (Commercial grade, 'C' suffix) 0C to +85C (Commercial)
Tindminan RoHS [DATA_NEEDED: RoHS status] Compliant
Level ng MSL [DATA_NEEDED: MSL level] —
Series — Stratix III
Logic Elements — 47,500
Logic Array Blocks (LABs) — 1,900
Embedded Memory Bits — 2,184,192
Package Type — 780-BBGA, FCBGA (FineLine)
Device Pin Count — 780
Speed Grade — 3
Supply Voltage (Core) — [DATA_NEEDED: VCCINT nominal value]
PLLs — 12
Global Clock Networks — 24
Process Node — 65 nm TSMC
Configuration Method — SRAM-based, supports Partial Reconfiguration
Lead-Free / Halogen-Free — Lead-Free (per package marking); Halogen-Free status unknown
Level ng Sensitivity sa Asid ng Moisture (MSL) — MSL3 (per JEDEC J-STD-020, typical for large FBGA)

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