EP3SL200F1517I3N vs EP3SL200F1517I4LN Perbandingan

Perbandingan bersamaan detil EP3SL200F1517I3N dari Intel dan EP3SL200F1517I4LN dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum EP3SL200F1517I3N EP3SL200F1517I4LN
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Obsolete NRND
Family Stratix III L Stratix III L
Logic Elements 200,000 200,000
Number of LABs 8000 —
Total Memory Bits 10,901,504 —
User I/Os 976 —
Number of Logic Cells 200000 —
Process Technology 65 nm 65 nm TSMC low-power
Core Voltage 1.1 V —
Maximum Internal Frequency 500 MHz —
Number of Transceivers [DATA_NEEDED: number of transceivers] —
Paket 1517-BBGA, FCBGA (FC-FBGA) 1517-BBGA, FCBGA
Tipe Mounting Surface Mount (BGA) Surface Mount (BGA)
Suhu Kerja -40C to +100C (Industrial) -40C to +100C (Industrial)
Supplier Device Package 1517-FBGA —
Status RoHS Compliant Compliant
Configuration Memory SRAM-based —
Number of 18x18 Multipliers 384 —
Embedded Memory Bits — 10,901,504
Logic Array Blocks (LABs) — 8,000
User I/O Pins — 976
Lead-Free — Yes
Level MSL — [DATA_NEEDED: MSL moisture sensitivity level]
Supply Voltage Core — [DATA_NEEDED: VCC core voltage]
Transceiver Data Rate (max) — [DATA_NEEDED: max transceiver rate]
DSP Blocks (18x18 multipliers) — 384
DSP Performance — 288 GMACS
Configuration Method — Passive Parallel / Active Serial / JTAG
Ball Pitch — 1.0 mm
Package Dimensions — 40 mm x 40 mm

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