EP3SL200F1517I3N vs EP3SL200F1517I4LN Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL200F1517I3N sa pamamagitan ng Intel at EP3SL200F1517I4LN sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SL200F1517I3N | EP3SL200F1517I4LN |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | NRND |
| Family | Stratix III L | Stratix III L |
| Logic Elements | 200,000 | 200,000 |
| Number of LABs | 8000 | — |
| Total Memory Bits | 10,901,504 | — |
| User I/Os | 976 | — |
| Number of Logic Cells | 200000 | — |
| Process Technology | 65 nm | 65 nm TSMC low-power |
| Core Voltage | 1.1 V | — |
| Maximum Internal Frequency | 500 MHz | — |
| Number of Transceivers | [DATA_NEEDED: number of transceivers] | — |
| Packhaging | 1517-BBGA, FCBGA (FC-FBGA) | 1517-BBGA, FCBGA |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Temperature na Operasyon | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Supplier Device Package | 1517-FBGA | — |
| Tindminan RoHS | Compliant | Compliant |
| Configuration Memory | SRAM-based | — |
| Number of 18x18 Multipliers | 384 | — |
| Embedded Memory Bits | — | 10,901,504 |
| Logic Array Blocks (LABs) | — | 8,000 |
| User I/O Pins | — | 976 |
| Lead-Free | — | Yes |
| Level ng MSL | — | [DATA_NEEDED: MSL moisture sensitivity level] |
| Supply Voltage Core | — | [DATA_NEEDED: VCC core voltage] |
| Transceiver Data Rate (max) | — | [DATA_NEEDED: max transceiver rate] |
| DSP Blocks (18x18 multipliers) | — | 384 |
| DSP Performance | — | 288 GMACS |
| Configuration Method | — | Passive Parallel / Active Serial / JTAG |
| Ball Pitch | — | 1.0 mm |
| Package Dimensions | — | 40 mm x 40 mm |