EP3SL200H780C3N vs EP3SE260H780C3N Perbandingan

Perbandingan bersamaan detil EP3SL200H780C3N dari Intel dan EP3SE260H780C3N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum EP3SL200H780C3N EP3SE260H780C3N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup NRND Aktif
Family Stratix III L (low-power) —
Process Node 40 nm —
Logic Elements 200,000 —
Embedded Memory Bits 10,901,504 bits —
Logic Array Blocks (LABs) 8,000 —
User I/Os 488 488
Paket 780-Ball FCBGA (HBGA), 29 x 29 mm 780-BBGA, FCBGA (H780)
Tipe Mounting Surface Mount Surface Mount
Maximum Internal Clock Frequency 800 MHz —
Transceivers 24 channels, up to 3.75 Gbps [DATA_NEEDED: number of embedded transceivers and max data rate]
DSP Blocks 384 [DATA_NEEDED: number of DSP blocks and precision]
Speed Grade C3 (commercial, -3 speed) —
Suhu Kerja 0C to +85C (commercial) 0 °C to +85 °C (C grade, commercial)
Voltage - Core 0.9 V / 1.0 V (core, VCC) —
Voltage - I/O 1.2 V to 3.3 V (VCCIO banks) —
Level MSL 3 —
Lead-Free / RoHS Yes —
Mounting Pitch 1.0 mm ball pitch —
PLLs 12 (Stratix III PLL array) —
Configuration JTAG IEEE Std 1149.1, passive/active serial —
Series — Stratix® III E
Logic Elements (LE) — 255,000
Embedded Memory (bits) — 16,672,768
Number of LABs/CLBs — 10,200
Number of Pins / Balls — 780
Process Technology — 40 nm CMOS
Maximum Core Frequency — [DATA_NEEDED: maximum core frequency MHz]
Supply Voltage (VCCINT) — [DATA_NEEDED: VCCINT nominal V]
Status RoHS — Compliant (lead-free 'N' suffix)
Tingkat Sensitivitas Kekeringan (MSL) — [DATA_NEEDED: MSL level per JEDEC J-STD-020]
Configuration Method — SRAM-based, configured via JTAG / passive / active serial / fast passive parallel
Design Toolchain — Altera Quartus II (legacy); Intel Quartus Prime

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