EP3SL200H780C3N vs EP3SL200H780C2N Perbandingan
Perbandingan bersamaan detil EP3SL200H780C3N dari Intel dan EP3SL200H780C2N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3SL200H780C3N | EP3SL200H780C2N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Family | Stratix III L (low-power) | Stratix III L |
| Process Node | 40 nm | — |
| Logic Elements | 200,000 | 200,000 |
| Embedded Memory Bits | 10,901,504 bits | 10,901,504 |
| Logic Array Blocks (LABs) | 8,000 | — |
| User I/Os | 488 | — |
| Paket | 780-Ball FCBGA (HBGA), 29 x 29 mm | 780-ball HBGA / FCBGA |
| Tipe Mounting | Surface Mount | Surface Mount |
| Maximum Internal Clock Frequency | 800 MHz | — |
| Transceivers | 24 channels, up to 3.75 Gbps | Per family capability - not specified for this OPN |
| DSP Blocks | 384 | — |
| Speed Grade | C3 (commercial, -3 speed) | C2 |
| Suhu Kerja | 0C to +85C (commercial) | Commercial (0C to +85C) |
| Voltage - Core | 0.9 V / 1.0 V (core, VCC) | — |
| Voltage - I/O | 1.2 V to 3.3 V (VCCIO banks) | — |
| Level MSL | 3 | — |
| Lead-Free / RoHS | Yes | — |
| Mounting Pitch | 1.0 mm ball pitch | — |
| PLLs | 12 (Stratix III PLL array) | — |
| Configuration | JTAG IEEE Std 1149.1, passive/active serial | — |
| Adaptive Logic Modules (ALMs) | — | 80,000 |
| User I/O Count | — | 488 |
| Process Technology | — | 65 nm CMOS |
| Core Voltage | — | 1.1 V |
| Maximum Internal Frequency | — | 800 MHz |
| Package Code | — | PBGA780 / HBGA-780 |
| Lead Free | — | Yes |
| Status RoHS | — | Compliant |