EP3SL200H780C3N vs EP3SL200H780C2N 比較
詳細並排比較 EP3SL200H780C3N 由 Intel 與 EP3SL200H780C2N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP3SL200H780C3N | EP3SL200H780C2N |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | NRND | NRND |
| Family | Stratix III L (low-power) | Stratix III L |
| Process Node | 40 nm | — |
| Logic Elements | 200,000 | 200,000 |
| Embedded Memory Bits | 10,901,504 bits | 10,901,504 |
| Logic Array Blocks (LABs) | 8,000 | — |
| User I/Os | 488 | — |
| 封裝 | 780-Ball FCBGA (HBGA), 29 x 29 mm | 780-ball HBGA / FCBGA |
| 安裝類型 | Surface Mount | Surface Mount |
| Maximum Internal Clock Frequency | 800 MHz | — |
| Transceivers | 24 channels, up to 3.75 Gbps | Per family capability - not specified for this OPN |
| DSP Blocks | 384 | — |
| Speed Grade | C3 (commercial, -3 speed) | C2 |
| 工作溫度 | 0C to +85C (commercial) | Commercial (0C to +85C) |
| Voltage - Core | 0.9 V / 1.0 V (core, VCC) | — |
| Voltage - I/O | 1.2 V to 3.3 V (VCCIO banks) | — |
| MSL 等級 | 3 | — |
| Lead-Free / RoHS | Yes | — |
| Mounting Pitch | 1.0 mm ball pitch | — |
| PLLs | 12 (Stratix III PLL array) | — |
| Configuration | JTAG IEEE Std 1149.1, passive/active serial | — |
| Adaptive Logic Modules (ALMs) | — | 80,000 |
| User I/O Count | — | 488 |
| Process Technology | — | 65 nm CMOS |
| Core Voltage | — | 1.1 V |
| Maximum Internal Frequency | — | 800 MHz |
| Package Code | — | PBGA780 / HBGA-780 |
| Lead Free | — | Yes |
| RoHS 狀態 | — | Compliant |