EP3SL200H780I4 vs EP3SL200H780I4LN Perbandingan

Perbandingan bersamaan detil EP3SL200H780I4 dari Intel dan EP3SL200H780I4LN dari Altera. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum EP3SL200H780I4 EP3SL200H780I4LN
Merek Intel Altera
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup NRND NRND
Series Stratix III L Stratix III L
Family Stratix III Stratix III L (Low-Power)
Logic Elements (LE) 200,000 —
Logic Array Blocks (LABs) 8000 —
Embedded Memory Bits 10,901,504 —
User I/O Count 488 —
DSP Multipliers (18x18) 384 —
Voltage - Core Supply 1.1 V —
Process Technology 65 nm CMOS 65 nm CMOS
Package Type 780-BBGA / FCBGA (FC-HFBGA) —
Package Dimensions 33 mm x 33 mm —
Speed Grade I4 (industrial) I4 (Industrial, mid-speed grade)
Suhu Hubung Kerja -40C to +100C (industrial) —
Configuration Memory SRAM-based, volatile —
Status RoHS Compliant RoHS Compliant (lead-free)
Design Tool Quartus II (legacy) / Quartus Prime —
Manufacturer — Intel / Altera (now Intel PSG)
Number of Logic Elements / Cells — 200,000
Number of LABs / CLBs — 8,000
Total RAM Bits — 10,901,504 (approximately 10.9 Mbit)
Number of I/O — 488
Voltage - Supply — 0.9 V core (selectable Vcore)
Suhu Kerja — -40C to +100C (industrial)
Tipe Mounting — Surface Mount
Paket / Case — 780-BBGA, FCBGA (Flip-Chip BGA)
Level MSL — MSL 3 (168 Hours, per JEDEC J-STD-020)
Roaming Pin Name Suffix — LN = lead-free, industrial temp, H780 780-ball package

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