EP3SL200H780I4 vs EP3SL200H780I4LN Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SL200H780I4 disebabkan oleh Intel dan EP3SL200H780I4LN disebabkan oleh Altera. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EP3SL200H780I4 EP3SL200H780I4LN
Merek Intel Altera
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup NRND NRND
Series Stratix III L Stratix III L
Family Stratix III Stratix III L (Low-Power)
Logic Elements (LE) 200,000 —
Logic Array Blocks (LABs) 8000 —
Embedded Memory Bits 10,901,504 —
User I/O Count 488 —
DSP Multipliers (18x18) 384 —
Voltage - Core Supply 1.1 V —
Process Technology 65 nm CMOS 65 nm CMOS
Package Type 780-BBGA / FCBGA (FC-HFBGA) —
Package Dimensions 33 mm x 33 mm —
Speed Grade I4 (industrial) I4 (Industrial, mid-speed grade)
Suhu Hubungan Operasi -40C to +100C (industrial) —
Configuration Memory SRAM-based, volatile —
Status RoHS Compliant RoHS Compliant (lead-free)
Design Tool Quartus II (legacy) / Quartus Prime —
Manufacturer — Intel / Altera (now Intel PSG)
Number of Logic Elements / Cells — 200,000
Number of LABs / CLBs — 8,000
Total RAM Bits — 10,901,504 (approximately 10.9 Mbit)
Number of I/O — 488
Voltage - Supply — 0.9 V core (selectable Vcore)
Suhu Operasi — -40C to +100C (industrial)
Jenis Pemasangan — Surface Mount
Kemasan / Case — 780-BBGA, FCBGA (Flip-Chip BGA)
Aras MSL — MSL 3 (168 Hours, per JEDEC J-STD-020)
Roaming Pin Name Suffix — LN = lead-free, industrial temp, H780 780-ball package

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