EP3SL200H780I4 vs EP3SL200H780I4LN Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL200H780I4 sa pamamagitan ng Intel at EP3SL200H780I4LN sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SL200H780I4 EP3SL200H780I4LN
Brand Intel Altera
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND NRND
Series Stratix III L Stratix III L
Family Stratix III Stratix III L (Low-Power)
Logic Elements (LE) 200,000 —
Logic Array Blocks (LABs) 8000 —
Embedded Memory Bits 10,901,504 —
User I/O Count 488 —
DSP Multipliers (18x18) 384 —
Voltage - Core Supply 1.1 V —
Process Technology 65 nm CMOS 65 nm CMOS
Package Type 780-BBGA / FCBGA (FC-HFBGA) —
Package Dimensions 33 mm x 33 mm —
Speed Grade I4 (industrial) I4 (Industrial, mid-speed grade)
Temperature ng Junction na Operasyon -40C to +100C (industrial) —
Configuration Memory SRAM-based, volatile —
Tindminan RoHS Compliant RoHS Compliant (lead-free)
Design Tool Quartus II (legacy) / Quartus Prime —
Manufacturer — Intel / Altera (now Intel PSG)
Number of Logic Elements / Cells — 200,000
Number of LABs / CLBs — 8,000
Total RAM Bits — 10,901,504 (approximately 10.9 Mbit)
Number of I/O — 488
Voltage - Supply — 0.9 V core (selectable Vcore)
Temperature na Operasyon — -40C to +100C (industrial)
Uri ng Pagpapasok — Surface Mount
Packhaging / Kaso — 780-BBGA, FCBGA (Flip-Chip BGA)
Level ng MSL — MSL 3 (168 Hours, per JEDEC J-STD-020)
Roaming Pin Name Suffix — LN = lead-free, industrial temp, H780 780-ball package

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