EP4SGX70DF29I3G vs EP4SGX70HF35C3G Perbandingan
Perbandingan bersamaan detil EP4SGX70DF29I3G dari Intel dan EP4SGX70HF35C3G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP4SGX70DF29I3G | EP4SGX70HF35C3G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | NRND |
| Series | Stratix IV GX | Stratix IV GX |
| Process Technology | 40 nm | 40 nm |
| Logic Elements (LE) | 72,600 | — |
| Embedded Memory Bits | 7,564,880 (about 7.5 Mbit) | — |
| Embedded Memory Blocks | 72600 | — |
| Number of Logic Cells / Arrays | 372 | — |
| Number of User I/O Pins | 372 | — |
| Number of Transceiver Channels | [DATA_NEEDED: exact channel count for this device] | — |
| Transceiver Data Rate | [DATA_NEEDED: per-channel data rate] | — |
| Package Type | 780-Ball FCBGA (Fine-pitch Chip-Scale BGA, flip-chip) | — |
| Package Code | DF29 | — |
| Operating Temperature Grade | Industrial (I3) | — |
| Junction Temperature Range | -40C to +100C | — |
| Core Supply Voltage | 0.87 V to 0.93 V | 0.87 V to 0.93 V |
| Speed Grade | -3 | HF35 |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Level MSL | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: MSL rating] |
| Status RoHS | Compliant | Compliant |
| Bebas Halogen | [DATA_NEEDED: halogen-free claim] | — |
| Logic Elements | — | 72,600 |
| LABs/CLBs | — | 2,904 |
| Total RAM Bits | — | 7,564,880 |
| User I/O Count | — | 488 |
| Number of Transceivers | — | 8 |
| Transceiver Data Rate (max) | — | 3.125 Gbps |
| Paket | — | 1152-BBGA, FCBGA (35 mm × 35 mm) |
| Operating Temperature (Junction) | — | 0°C to 85°C |
| Temperature Grade | — | Commercial (C3) |
| Configuration Method | — | Passive Serial, Fast Passive Parallel, Active Serial, JTAG |