EP4SGX70DF29I3G vs EP4SGX70HF35C3G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP4SGX70DF29I3G disebabkan oleh Intel dan EP4SGX70HF35C3G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP4SGX70DF29I3G | EP4SGX70HF35C3G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | NRND |
| Series | Stratix IV GX | Stratix IV GX |
| Process Technology | 40 nm | 40 nm |
| Logic Elements (LE) | 72,600 | — |
| Embedded Memory Bits | 7,564,880 (about 7.5 Mbit) | — |
| Embedded Memory Blocks | 72600 | — |
| Number of Logic Cells / Arrays | 372 | — |
| Number of User I/O Pins | 372 | — |
| Number of Transceiver Channels | [DATA_NEEDED: exact channel count for this device] | — |
| Transceiver Data Rate | [DATA_NEEDED: per-channel data rate] | — |
| Package Type | 780-Ball FCBGA (Fine-pitch Chip-Scale BGA, flip-chip) | — |
| Package Code | DF29 | — |
| Operating Temperature Grade | Industrial (I3) | — |
| Junction Temperature Range | -40C to +100C | — |
| Core Supply Voltage | 0.87 V to 0.93 V | 0.87 V to 0.93 V |
| Speed Grade | -3 | HF35 |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Aras MSL | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: MSL rating] |
| Status RoHS | Compliant | Compliant |
| Boson Bebas | [DATA_NEEDED: halogen-free claim] | — |
| Logic Elements | — | 72,600 |
| LABs/CLBs | — | 2,904 |
| Total RAM Bits | — | 7,564,880 |
| User I/O Count | — | 488 |
| Number of Transceivers | — | 8 |
| Transceiver Data Rate (max) | — | 3.125 Gbps |
| Kemasan | — | 1152-BBGA, FCBGA (35 mm × 35 mm) |
| Operating Temperature (Junction) | — | 0°C to 85°C |
| Temperature Grade | — | Commercial (C3) |
| Configuration Method | — | Passive Serial, Fast Passive Parallel, Active Serial, JTAG |