K4A4G165WD-BCRC vs K4A4G165WF-BCWE Perbandingan
Perbandingan bersamaan detil K4A4G165WD-BCRC dari Samsung Electronics dan K4A4G165WF-BCWE dari Samsung Electronics. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | K4A4G165WD-BCRC | K4A4G165WF-BCWE |
|---|---|---|
| Merek | Samsung Electronics | Samsung Electronics |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Status Stok | — | In Stock |
| Harga Unit (USD) | — | $10,65 |
| Tipe Memori | DDR4 SDRAM | DDR4 SDRAM |
| Density | 4 Gbit | — |
| Organisasi | 256M x 16 | 256M x 16 |
| Speed Bin | DDR4-2400 (BCRC) | — |
| Tegangan Pemuat | 1.2 V | 1.2 V (1.14 V to 1.26 V) |
| Paket | FBGA-96 | FBGA-96 (TFBGA) |
| Tipe Mounting | Surface Mount | Surface Mount |
| Process Generation | Samsung D-die | — |
| Tipe Antarmuka | DDR4 (double data rate, parallel) | — |
| On-Die Termination (ODT) | Yes | — |
| Data Mask Function | Yes | — |
| Auto Precharge | Yes | Supported |
| CRC Function | Yes | — |
| ZQ Calibration | Yes | Supported |
| Suhu Kerja | [DATA_NEEDED: operating temperature range] | 0C to +85C |
| Status RoHS | Lead free / RoHS Compliant | Compliant (per JLCPCB listing) |
| Package Dimensions | [DATA_NEEDED: package dimensions] | — |
| Memory Density | — | 4 Gbit |
| Laju Data | — | 3200 Mbps |
| Clock Frequency | — | 1.6 GHz |
| Access Time | — | 19 ns |
| Antarmuka | — | Parallel |
| Die Generation | — | Samsung F-die |
| Data Mask | — | Supported (DM) |
| On-Die Termination | — | Dynamic ODT supported |
| CRC | — | Supported |
| Asynchronous Reset | — | Supported |