K4A8G085WB-BICH vs K4A8G085WB-BCPB Perbandingan
Perbandingan bersamaan detil K4A8G085WB-BICH dari Samsung Electronics dan K4A8G085WB-BCPB dari Samsung Electronics. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | K4A8G085WB-BICH | K4A8G085WB-BCPB |
|---|---|---|
| Merek | Samsung Electronics | Samsung Electronics |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Harga Unit (USD) | — | $4,10 |
| Tipe Memori | DDR4 SDRAM | DDR4 SDRAM (volatile DRAM) |
| Density | 8Gb | — |
| Organisasi | 1G x 8 | — |
| Tegangan Pemuat | 1.2V | 1.2 V |
| Laju Data | 2400 Mbps (DDR4-2400) | — |
| Paket | 78-ball FBGA | 78-ball FBGA (BGA78 / TFBGA), rectangular, 11 mm length |
| Suhu Kerja | 0°C to 85°C | 0C to +85C |
| Max Supply Current | 170mA | — |
| Burst Length | BL8, BL16 | — |
| Latensi CAS | Programmable | — |
| On-Die ECC | Yes | — |
| Data Bus Inversion | Yes | — |
| RoHS | Compliant | — |
| Lead-Free | Yes | — |
| Die Revision | B-die | — |
| Ukuran Memori | — | 8 Gb |
| Memory Organization | — | 1G x 8 |
| Max Clock Frequency | — | 1066 MHz |
| Max Access Time | — | 0.18 ns |
| Max Standby Current | — | 0.016 mA |
| Refresh Cycles | — | 8192 |
| Technology | — | CMOS, 8Gb B-die |
| Number of Terminals | — | 78 |
| Tipe Mounting | — | Surface Mount |
| Antarmuka | — | DDR4 SDRAM parallel interface |
| Status RoHS | — | [DATA_NEEDED: RoHS status] |
| Operating Temperature Grade | — | Commercial (0C to 85C) |