K4AAG165WA-BCPB vs K4AAG165WA-BCWE Perbandingan
Perbandingan bersamaan detil K4AAG165WA-BCPB dari Samsung Electronics dan K4AAG165WA-BCWE dari Samsung Electronics. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Samsung Electronics
K4AAG165WA-BCPB - 16Gb DDR4 SDRAM 3200Mbps 1.2V | Samsung
K4AAG165WA-BCPB ✓ AktifPerbandingan Spesifikasi
| Parameter Umum | K4AAG165WA-BCPB | K4AAG165WA-BCWE |
|---|---|---|
| Merek | Samsung Electronics | Samsung Electronics |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Tipe Memori | Volatile DRAM (DDR4 SDRAM) | DDR4 SDRAM |
| Technology | DDR4 | DDR4 SDRAM, 8n prefetch, bank group architecture |
| Density | 16 Gb | — |
| Organisasi | 1G x 16 | — |
| Laju Data | 3200 Mbps | 3200 Mbps (DDR4-3200) |
| Supply Voltage (VDD) | 1.2 V | — |
| Interface Voltage (VDDQ) | 1.2 V | — |
| Paket | FBGA-96 | 96-ball FBGA |
| Tipe Mounting | Surface Mount | Surface Mount |
| Suhu Kerja | [DATA_NEEDED: operating temperature for BCPB grade] | -40C to +95C |
| Memory Format | DRAM | DRAM (Volatile) |
| Packaging | Tray | Tray |
| Product Status | Active | Active |
| Power Consumption | 25% lower than DDR3 (per Samsung DDR4 family) | — |
| Bank Group Architecture | Yes (DDR4 internal bank groups) | — |
| On-Die Termination (ODT) | Yes | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Max Capacity Family | Up to 32GB component (Samsung DDR4 family) | — |
| Ukuran Memori | — | 16 Gb (2 GB) |
| Memory Organization | — | 1G x 16 |
| Tegangan Pemuat | — | 1.2 V |
| Package Dimensions | — | 13 x 9 mm |
| Ball Pitch | — | 0.8 mm |
| Tipe Antarmuka | — | Parallel, DDR4 |