K4AAG165WA-BCPB vs K4AAG165WA-BCWE 比較
詳細並排比較 K4AAG165WA-BCPB 由 Samsung Electronics 與 K4AAG165WA-BCWE 由 Samsung Electronics. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | K4AAG165WA-BCPB | K4AAG165WA-BCWE |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 類別 | Memory ICs | Memory ICs |
| 生命週期狀態 | 啟用中 | 啟用中 |
| 記憶體類型 | Volatile DRAM (DDR4 SDRAM) | DDR4 SDRAM |
| Technology | DDR4 | DDR4 SDRAM, 8n prefetch, bank group architecture |
| Density | 16 Gb | — |
| 組織 | 1G x 16 | — |
| 資料速率 | 3200 Mbps | 3200 Mbps (DDR4-3200) |
| Supply Voltage (VDD) | 1.2 V | — |
| Interface Voltage (VDDQ) | 1.2 V | — |
| 封裝 | FBGA-96 | 96-ball FBGA |
| 安裝類型 | Surface Mount | Surface Mount |
| 工作溫度 | [DATA_NEEDED: operating temperature for BCPB grade] | -40C to +95C |
| Memory Format | DRAM | DRAM (Volatile) |
| Packaging | Tray | Tray |
| Product Status | Active | Active |
| Power Consumption | 25% lower than DDR3 (per Samsung DDR4 family) | — |
| Bank Group Architecture | Yes (DDR4 internal bank groups) | — |
| On-Die Termination (ODT) | Yes | — |
| RoHS 狀態 | [DATA_NEEDED: RoHS status] | Compliant |
| Max Capacity Family | Up to 32GB component (Samsung DDR4 family) | — |
| 記憶體容量 | — | 16 Gb (2 GB) |
| Memory Organization | — | 1G x 16 |
| 供應電壓 | — | 1.2 V |
| Package Dimensions | — | 13 x 9 mm |
| Ball Pitch | — | 0.8 mm |
| 介面類型 | — | Parallel, DDR4 |