K4AAG165WA-BCTD vs K4AAG165WA-BCWE Perbandingan
Perbandingan bersamaan detil K4AAG165WA-BCTD dari Samsung Electronics dan K4AAG165WA-BCWE dari Samsung Electronics. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | K4AAG165WA-BCTD | K4AAG165WA-BCWE |
|---|---|---|
| Merek | Samsung Electronics | Samsung Electronics |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Tipe Memori | DDR4 SDRAM | DDR4 SDRAM |
| Ukuran Memori | 16 Gb | 16 Gb (2 GB) |
| Memory Organization | 1G x 16 | 1G x 16 |
| Laju Data | 2666 Mbps | 3200 Mbps (DDR4-3200) |
| Tegangan Pemuat | 1.2 V | 1.2 V |
| Antarmuka | Synchronous, DDR4 | — |
| Suhu Kerja | 0C to +85C | -40C to +95C |
| Paket | 96-FBGA | 96-ball FBGA |
| Tipe Mounting | Surface Mount | Surface Mount |
| Memory Format | Volatile (DRAM) | DRAM (Volatile) |
| Bank Architecture | DDR4 bank-group architecture | — |
| Technology Family | DDR4 SDRAM (Samsung K4AAG165WA series) | — |
| Application Class | Computing, embedded, consumer main memory | — |
| Package Family | FBGA -> fine-pitch BGA -> surface mount | — |
| Temperature Grade | Commercial (0C to +85C) | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Level MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Package Dimensions | — | 13 x 9 mm |
| Ball Pitch | — | 0.8 mm |
| Tipe Antarmuka | — | Parallel, DDR4 |
| Technology | — | DDR4 SDRAM, 8n prefetch, bank group architecture |
| Packaging | — | Tray |
| Product Status | — | Active |