K4AAG165WA-BCTD vs K4AAG165WA-BCWE Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng K4AAG165WA-BCTD sa pamamagitan ng Samsung Electronics at K4AAG165WA-BCWE sa pamamagitan ng Samsung Electronics. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Samsung Electronics
K4AAG165WA-BCTD - 16Gb DDR4 SDRAM 2666Mbps | Samsung
K4AAG165WA-BCTD ✓ NakahandaSamsung Electronics
K4AAG165WA-BCWE - 16Gb DDR4 3200Mbps SDRAM | Samsung
K4AAG165WA-BCWE ✓ NakahandaPagsanggunian na paghahambing
| Parametro | K4AAG165WA-BCTD | K4AAG165WA-BCWE |
|---|---|---|
| Brand | Samsung Electronics | Samsung Electronics |
| Kategorya | Memory ICs | Memory ICs |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Uri ng Memory | DDR4 SDRAM | DDR4 SDRAM |
| Laki ng Memory | 16 Gb | 16 Gb (2 GB) |
| Memory Organization | 1G x 16 | 1G x 16 |
| Rate ng Data | 2666 Mbps | 3200 Mbps (DDR4-3200) |
| Volte ng Pagbibigay | 1.2 V | 1.2 V |
| Interface | Synchronous, DDR4 | — |
| Temperature na Operasyon | 0C to +85C | -40C to +95C |
| Packhaging | 96-FBGA | 96-ball FBGA |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Memory Format | Volatile (DRAM) | DRAM (Volatile) |
| Bank Architecture | DDR4 bank-group architecture | — |
| Technology Family | DDR4 SDRAM (Samsung K4AAG165WA series) | — |
| Application Class | Computing, embedded, consumer main memory | — |
| Package Family | FBGA -> fine-pitch BGA -> surface mount | — |
| Temperature Grade | Commercial (0C to +85C) | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Level ng MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Package Dimensions | — | 13 x 9 mm |
| Ball Pitch | — | 0.8 mm |
| Uri ng Interface | — | Parallel, DDR4 |
| Technology | — | DDR4 SDRAM, 8n prefetch, bank group architecture |
| Packaging | — | Tray |
| Product Status | — | Active |