K4AAG165WA-BCTD vs K4AAG165WA-BCWE Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci K4AAG165WA-BCTD disebabkan oleh Samsung Electronics dan K4AAG165WA-BCWE disebabkan oleh Samsung Electronics. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | K4AAG165WA-BCTD | K4AAG165WA-BCWE |
|---|---|---|
| Merek | Samsung Electronics | Samsung Electronics |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Jenis Ingatan | DDR4 SDRAM | DDR4 SDRAM |
| Saiz Ingatan | 16 Gb | 16 Gb (2 GB) |
| Memory Organization | 1G x 16 | 1G x 16 |
| Kadar Data | 2666 Mbps | 3200 Mbps (DDR4-3200) |
| Tegangan Pemberi Arus | 1.2 V | 1.2 V |
| Antaramuka | Synchronous, DDR4 | — |
| Suhu Operasi | 0C to +85C | -40C to +95C |
| Kemasan | 96-FBGA | 96-ball FBGA |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Memory Format | Volatile (DRAM) | DRAM (Volatile) |
| Bank Architecture | DDR4 bank-group architecture | — |
| Technology Family | DDR4 SDRAM (Samsung K4AAG165WA series) | — |
| Application Class | Computing, embedded, consumer main memory | — |
| Package Family | FBGA -> fine-pitch BGA -> surface mount | — |
| Temperature Grade | Commercial (0C to +85C) | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Aras MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Package Dimensions | — | 13 x 9 mm |
| Ball Pitch | — | 0.8 mm |
| Jenis Antaramuka | — | Parallel, DDR4 |
| Technology | — | DDR4 SDRAM, 8n prefetch, bank group architecture |
| Packaging | — | Tray |
| Product Status | — | Active |