K4B4G1646D-BYMA0 vs K4B4G1646D-BYK0 Perbandingan
Perbandingan bersamaan detil K4B4G1646D-BYMA0 dari Samsung Electronics dan K4B4G1646D-BYK0 dari Samsung Electronics. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Samsung Electronics
K4B4G1646D-BYMA0 - 4Gb DDR3L SDRAM x16 96FBGA | Samsung
K4B4G1646D-BYMA0 ✓ AktifPerbandingan Spesifikasi
| Parameter Umum | K4B4G1646D-BYMA0 | K4B4G1646D-BYK0 |
|---|---|---|
| Merek | Samsung Electronics | Samsung Electronics |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Tipe Memori | DDR3L SDRAM | DDR3L SDRAM |
| Organisasi | 256M x 16 | 256M x 16 |
| Total Memory Size | 4 Gb | — |
| Tegangan Pemuat | 1.35 V | 1.35 V (1.5 V compatible) |
| Laju Data | 1866 Mbps (PC3-14900) | 1600 Mbps (PC3-12800) |
| Paket | 96-ball FBGA | 96-ball FBGA |
| Rentang Suhu Kerja | 0°C to +85°C | — |
| Lead-Free | Yes | Yes |
| Bebas Halogen | Yes | Yes |
| RoHS Compliant | Yes | Yes |
| Auto Precharge | Supported | — |
| Asynchronous Reset | Supported | — |
| ZQ Calibration | Supported | — |
| Data Mask | Supported | — |
| Dynamic On-Chip Termination | Supported | — |
| Density | — | 4 Gbit |
| Suhu Kerja | — | 0°C to 85°C |
| Latensi CAS | — | Programmable (e.g., 11, 10, 9) |
| Burst Length | — | 8 (with burst chop 4) |
| On-Die Termination | — | Yes |
| Jumlah Pin | — | 96 |
| Die Revision | — | D-die |