KMPC8321CVRADDC vs MPC8321CVRADDC Perbandingan
Perbandingan bersamaan detil KMPC8321CVRADDC dari NXP Semiconductors dan MPC8321CVRADDC dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
KMPC8321CVRADDC - PowerPC e300c2 MPU 266MHz 516-PBGA | NXP
KMPC8321CVRADDC ✓ AktifNXP Semiconductors
MPC8321CVRADDC - 266MHz PowerQUICC II Pro MPU, 516-PBGA | NXP
MPC8321CVRADDC ✓ AktifPerbandingan Spesifikasi
| Parameter Umum | KMPC8321CVRADDC | MPC8321CVRADDC |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | PowerQUICC (MPC83xx) | — |
| Core | PowerPC e300c2 (32-bit, single-core) | PowerPC e300c2 |
| Core Frequency | 266 MHz | — |
| Paket | 516-PBGA (27 mm x 27 mm) | — |
| Operating Voltage (Core) | 1.2 V nominal [DATA_NEEDED: exact range] | — |
| Memory Controller | DDR1/DDR2 SDRAM controller with ECC | — |
| L1 Cache | 16 KB instruction / 16 KB data | — |
| PCI Interface | PCI 2.3, 32-bit, up to 66 MHz | — |
| Ethernet | 2x 10/100 Mbps MAC (MII/RMII) | — |
| USB | USB 2.0 Full-Speed (12 Mbps) device/host | — |
| Local Bus | 8/16/32-bit, NAND Flash support | — |
| DMA Channels | 4 | — |
| I2C / UART / SPI | 2x I2C, 2x UART, 1x SPI | — |
| Security Engine | DES / 3DES / AES / SHA / MD5 accelerator | — |
| Suhu Kerja | 0°C to +70°C commercial [DATA_NEEDED: confirm industrial grade option] | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Level MSL | [DATA_NEEDED: MSL rating] | — |
| Status RoHS | [DATA_NEEDED: RoHS classification] | [DATA_NEEDED: RoHS compliance status] |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Product Category | — | Microprocessors (MPU) |
| Processor Series | — | MPC8xxx / MPC83xx |
| Core Architecture | — | 32-bit Power Architecture |
| Core Clock Speed | — | 266 MHz |
| Number of Cores | — | 1 |
| Process Technology | — | 90 nm CMOS |
| Tegangan Pemuat | — | 1.8 V / 2.5 V / 3.3 V |
| Package Type | — | 516-ball TEBGA (Plastic Ball Grid Array) |
| Package Dimensions | — | 27 mm x 27 mm |
| Rentang Suhu Kerja | — | -40C to +105C |
| Integrated Memory Controller | — | DDR1 / DDR2 SDRAM |
| Integrated Peripherals | — | QUICC Engine, PCI, USB 2.0, UART, I2C, GPIO, TDM/HDLC |
| Encryption / SEC Block | — | Not included (non-E variant) |