KMPC8321CVRADDC vs MPC8321CVRADDC Karşılaştırma
Ayrıntılı yan yana karşılaştırma KMPC8321CVRADDC tarafından NXP Semiconductors ve MPC8321CVRADDC tarafından NXP SemiconductorsAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
NXP Semiconductors
KMPC8321CVRADDC - PowerPC e300c2 MPU 266MHz 516-PBGA | NXP
KMPC8321CVRADDC ✓ AktifNXP Semiconductors
MPC8321CVRADDC - 266MHz PowerQUICC II Pro MPU, 516-PBGA | NXP
MPC8321CVRADDC ✓ AktifÖzellik Karşılaştırması
| Parametre | KMPC8321CVRADDC | MPC8321CVRADDC |
|---|---|---|
| Marka | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Yaşam Döngüsü Durumu | Aktif | Aktif |
| Family | PowerQUICC (MPC83xx) | — |
| Core | PowerPC e300c2 (32-bit, single-core) | PowerPC e300c2 |
| Core Frequency | 266 MHz | — |
| Paket | 516-PBGA (27 mm x 27 mm) | — |
| Operating Voltage (Core) | 1.2 V nominal [DATA_NEEDED: exact range] | — |
| Memory Controller | DDR1/DDR2 SDRAM controller with ECC | — |
| L1 Cache | 16 KB instruction / 16 KB data | — |
| PCI Interface | PCI 2.3, 32-bit, up to 66 MHz | — |
| Ethernet | 2x 10/100 Mbps MAC (MII/RMII) | — |
| USB | USB 2.0 Full-Speed (12 Mbps) device/host | — |
| Local Bus | 8/16/32-bit, NAND Flash support | — |
| DMA Channels | 4 | — |
| I2C / UART / SPI | 2x I2C, 2x UART, 1x SPI | — |
| Security Engine | DES / 3DES / AES / SHA / MD5 accelerator | — |
| İşletim Sıcaklığı | 0°C to +70°C commercial [DATA_NEEDED: confirm industrial grade option] | — |
| Montaj Türü | Surface Mount (BGA) | Surface Mount |
| MSL Seviyesi | [DATA_NEEDED: MSL rating] | — |
| RoHS Durumu | [DATA_NEEDED: RoHS classification] | [DATA_NEEDED: RoHS compliance status] |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Product Category | — | Microprocessors (MPU) |
| Processor Series | — | MPC8xxx / MPC83xx |
| Core Architecture | — | 32-bit Power Architecture |
| Core Clock Speed | — | 266 MHz |
| Number of Cores | — | 1 |
| Process Technology | — | 90 nm CMOS |
| Besleme Gerilimi | — | 1.8 V / 2.5 V / 3.3 V |
| Package Type | — | 516-ball TEBGA (Plastic Ball Grid Array) |
| Package Dimensions | — | 27 mm x 27 mm |
| İşletim Sıcaklığı Aralığı | — | -40C to +105C |
| Integrated Memory Controller | — | DDR1 / DDR2 SDRAM |
| Integrated Peripherals | — | QUICC Engine, PCI, USB 2.0, UART, I2C, GPIO, TDM/HDLC |
| Encryption / SEC Block | — | Not included (non-E variant) |