LPC5526JBD64E vs LPC55S28JBD64E Perbandingan
Perbandingan bersamaan detil LPC5526JBD64E dari NXP Semiconductors dan LPC55S28JBD64E dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | LPC5526JBD64E | LPC55S28JBD64E |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | Aktif |
| Core Processor | ARM Cortex-M33 (r0p3) | Arm Cortex-M33 |
| Core Size | 32-Bit | 32-Bit |
| Frekuensi Bawah Maximum | 150 MHz | 150 MHz |
| Flash Memory | 256KB (256K x 8) | — |
| RAM Size | [DATA_NEEDED: SRAM size] | — |
| Security Feature | ARM TrustZone | — |
| Memory Protection Unit | Yes (MPU) | Yes (MPU) |
| Interrupt Controller | NVIC (built-in) | NVIC with NMI input (selectable sources) |
| NMI Input | Yes, with selection of sources | — |
| Process Technology | 40 nm NVM | 40 nm NVM |
| Tegangan Pemuat | [DATA_NEEDED: supply voltage range] | [DATA_NEEDED: supply voltage range] |
| Suhu Kerja | [DATA_NEEDED: temperature range] | [DATA_NEEDED: operating temperature range] |
| Paket | 64-HTQFP (10x10 mm) | 64-HTQFP (10x10 mm) |
| Tipe Mounting | Surface Mount | Surface Mount |
| Tingkat Sensitivitas Kekeringan (MSL) | 3 | 3 |
| Peak Reflow Temperature | 260 C | 260 C |
| Max Time At Peak Reflow | 30 s | — |
| Terminal Finish | Tin (JESD-609 code e3) | Tin (JESD-609 code e3) |
| Status RoHS | Compliant | Compliant (e3 lead-free finish) |
| Status Lingkungan Hidup | Active | — |
| Flash Memory Size | — | 512 KB (512K x 8) |
| SRAM Size | — | 128 KB |
| Series | — | LPC55S2x |
| Security Features | — | TrustZone, PUF-based security (S-series) |
| Maximum Time at Peak Reflow | — | 30 s |