LPC5526JBD64E vs LPC55S28JBD64E Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci LPC5526JBD64E disebabkan oleh NXP Semiconductors dan LPC55S28JBD64E disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | LPC5526JBD64E | LPC55S28JBD64E |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | Aktif |
| Core Processor | ARM Cortex-M33 (r0p3) | Arm Cortex-M33 |
| Core Size | 32-Bit | 32-Bit |
| Frekuensi Klock Maksimum | 150 MHz | 150 MHz |
| Flash Memory | 256KB (256K x 8) | — |
| RAM Size | [DATA_NEEDED: SRAM size] | — |
| Security Feature | ARM TrustZone | — |
| Memory Protection Unit | Yes (MPU) | Yes (MPU) |
| Interrupt Controller | NVIC (built-in) | NVIC with NMI input (selectable sources) |
| NMI Input | Yes, with selection of sources | — |
| Process Technology | 40 nm NVM | 40 nm NVM |
| Tegangan Pemberi Arus | [DATA_NEEDED: supply voltage range] | [DATA_NEEDED: supply voltage range] |
| Suhu Operasi | [DATA_NEEDED: temperature range] | [DATA_NEEDED: operating temperature range] |
| Kemasan | 64-HTQFP (10x10 mm) | 64-HTQFP (10x10 mm) |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Tingkat sensitiviti Air Nama (MSL) | 3 | 3 |
| Peak Reflow Temperature | 260 C | 260 C |
| Max Time At Peak Reflow | 30 s | — |
| Terminal Finish | Tin (JESD-609 code e3) | Tin (JESD-609 code e3) |
| Status RoHS | Compliant | Compliant (e3 lead-free finish) |
| Status Lingkungan Hidup | Active | — |
| Flash Memory Size | — | 512 KB (512K x 8) |
| SRAM Size | — | 128 KB |
| Series | — | LPC55S2x |
| Security Features | — | TrustZone, PUF-based security (S-series) |
| Maximum Time at Peak Reflow | — | 30 s |