M29W320DT70N3E vs M29DW323DB70N3E Perbandingan

Perbandingan bersamaan detil M29W320DT70N3E dari Micron Technology dan M29DW323DB70N3E dari Micron Technology. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Micron Technology
M29W320DT70N3E M29W320DT70N3E - 32Mbit NOR Flash 70ns 48-TSOP | Micron

M29W320DT70N3E - 32Mbit NOR Flash 70ns 48-TSOP | Micron

M29W320DT70N3E ✓ Aktif
Micron Technology
M29DW323DB70N3E M29DW323DB70N3E - 32Mb NOR Flash 70ns 48-TSOP | Micron

M29DW323DB70N3E - 32Mb NOR Flash 70ns 48-TSOP | Micron

M29DW323DB70N3E ✓ Aktif

Perbandingan Spesifikasi

Parameter Umum M29W320DT70N3E M29DW323DB70N3E
Merek Micron Technology Micron Technology
Kategori Memory ICs Memory ICs
Status Lingkungan Hidup Aktif Aktif
Tipe Memori NOR Flash Flash - NOR
Ukuran Memori 32 Mbit —
Organisasi 4M x8 / 2M x16 —
Antarmuka Parallel Parallel
Access Time 70 ns 70 ns
Supply Voltage (VCC) 2.7 V to 3.6 V —
Read Current (typical) 10 mA —
Boot Block Architecture Top boot (DT suffix) —
Boot Region 16 KByte boot block, two 8 KByte parameter blocks, 32 KByte small main block —
Paket 48-TSOP I 48-TSOP I
Package Length 18.4 mm —
Tipe Mounting Surface Mount Surface Mount
Level MSL 3 (168 Hours) —
Peak Reflow Temperature Time 30 s —
Packaging Tray —
Suhu Kerja [DATA_NEEDED: operating temperature range] -40C to +125C
Program/Erase Cycles [DATA_NEEDED: endurance] —
Status RoHS [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
Memory Format — FLASH
Technology — FLASH - NOR Memory IC
Density — 32 Mb (4M x 8, 2M x 16)
Memory Organization — 4M x 8 / 2M x 16
Tegangan Pemuat — 3 V class (per manufacturer datasheet)
Boot Block Location — Bottom (DB variant)
Byte/Word Organization Select — Yes (BYTE pin)
Applications Domain — Embedded code storage / XIP
Standard Pack Quantity — [DATA_NEEDED: standard pack quantity]

Spek dan Sumber

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