MC56F82726VLF vs MC56F8322MFAE Perbandingan
Perbandingan bersamaan detil MC56F82726VLF dari NXP Semiconductors dan MC56F8322MFAE dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MC56F82726VLF - 32-bit DSC, 100MHz, 32KB Flash, 48-LQFP | NXP
MC56F82726VLF ✓ AktifPerbandingan Spesifikasi
| Parameter Umum | MC56F82726VLF | MC56F8322MFAE |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | NRND |
| Core | 56800EX 32-bit DSC | 56800E |
| Maximum CPU Frequency | 100 MHz | — |
| Program Flash | 32 KB (16K x 16) | — |
| RAM | 8 KB (4K x 16) | — |
| Paket | 48-LQFP (VLF), 7x7 mm | 48-LQFP (7x7 mm) |
| Operating Voltage | 2.7 V to 3.6 V | — |
| I/O Voltage Tolerance | 5 V TTL-compatible (RESET is 3.3 V only) | — |
| ADC | Dual 12-bit, with sample-and-hold [DATA_NEEDED: number of ADC channels] | — |
| PWM Module | eFlexPWM, up to 6 channels [DATA_NEEDED: exact channel count per module] | — |
| Comparators | Yes, on-chip analog comparators for current protection | — |
| Quadrature Decoder | Yes | — |
| Communication | [DATA_NEEDED: list of SCI/SPI/I2C/CAN counts] | — |
| Suhu Kerja | -40C to +105C (industrial, VLF suffix) | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Level MSL | [DATA_NEEDED: moisture sensitivity level] | [DATA_NEEDED: MSL rating] |
| Status RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Process Technology | High-density low-power CMOS | — |
| Jumlah Pin | 48 | — |
| Lebar Bus Data | — | 16 bit |
| Frekuensi Bawah Maximum | — | 60 MHz |
| Sustained Throughput | — | 60 MIPS |
| Program Memory Size | — | 32 KB (16K x 16) Flash |
| Tegangan Pemuat Kerja | — | 2.5 V core / 3.3 V I/O |
| Rentang Suhu Kerja | — | -40 C to +105 C (automotive grade) |
| Temperature Grade | — | Automotive |
| Number of I/Os | — | 21 |
| Communication Interfaces | — | CAN, SCI, SPI |
| Architecture | — | Harvard, 3 execution units, up to 6 ops/cycle |