MC56F82726VLF vs MC56F8322MFAE Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MC56F82726VLF disebabkan oleh NXP Semiconductors dan MC56F8322MFAE disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
MC56F82726VLF - 32-bit DSC, 100MHz, 32KB Flash, 48-LQFP | NXP
MC56F82726VLF ✓ AktifPengandingan Spesifikasi
| Parametr | MC56F82726VLF | MC56F8322MFAE |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | NRND |
| Core | 56800EX 32-bit DSC | 56800E |
| Maximum CPU Frequency | 100 MHz | — |
| Program Flash | 32 KB (16K x 16) | — |
| RAM | 8 KB (4K x 16) | — |
| Kemasan | 48-LQFP (VLF), 7x7 mm | 48-LQFP (7x7 mm) |
| Operating Voltage | 2.7 V to 3.6 V | — |
| I/O Voltage Tolerance | 5 V TTL-compatible (RESET is 3.3 V only) | — |
| ADC | Dual 12-bit, with sample-and-hold [DATA_NEEDED: number of ADC channels] | — |
| PWM Module | eFlexPWM, up to 6 channels [DATA_NEEDED: exact channel count per module] | — |
| Comparators | Yes, on-chip analog comparators for current protection | — |
| Quadrature Decoder | Yes | — |
| Communication | [DATA_NEEDED: list of SCI/SPI/I2C/CAN counts] | — |
| Suhu Operasi | -40C to +105C (industrial, VLF suffix) | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Aras MSL | [DATA_NEEDED: moisture sensitivity level] | [DATA_NEEDED: MSL rating] |
| Status RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Process Technology | High-density low-power CMOS | — |
| Kiraan Pin | 48 | — |
| Lebar Bus Data | — | 16 bit |
| Frekuensi Klock Maksimum | — | 60 MHz |
| Sustained Throughput | — | 60 MIPS |
| Program Memory Size | — | 32 KB (16K x 16) Flash |
| Tegangan Pemberi Arus Operasi | — | 2.5 V core / 3.3 V I/O |
| Gambaran Suhu Operasi | — | -40 C to +105 C (automotive grade) |
| Temperature Grade | — | Automotive |
| Number of I/Os | — | 21 |
| Communication Interfaces | — | CAN, SCI, SPI |
| Architecture | — | Harvard, 3 execution units, up to 6 ops/cycle |