MC9S08QD4VSC vs S9S08QD4J2MSCR Perbandingan
Perbandingan bersamaan detil MC9S08QD4VSC dari NXP Semiconductors dan S9S08QD4J2MSCR dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | MC9S08QD4VSC | S9S08QD4J2MSCR |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Akhir Hidup | Aktif |
| Core Processor | S08 (HCS08) | — |
| Core Size | 8-bit | — |
| Frekuensi Bawah Maximum | 16 MHz (bus up to 8 MHz per FindIC; 20 MHz CPU capable per datasheet) | — |
| Flash Memory | 4 KB (4K x 8) | — |
| RAM | 256 B | — |
| ADC Resolution | 10-bit | — |
| ADC Channels | 4 | — |
| GPIO Count | 6 | — |
| Instruction Set | CISC (HC08 with added BGND instruction) | — |
| Debug Interface | Background Debug Mode (BDM), single breakpoint on-chip | — |
| Paket | 8-SOIC | 8-SOIC (0.154 inch, 3.90 mm width) |
| Tipe Mounting | Surface Mount | Surface Mount |
| Suhu Kerja | [DATA_NEEDED: operating temperature range] | -40 C to +125 C |
| Tegangan Pemuat | [DATA_NEEDED: supply voltage range] | 2.7 V to 5.5 V |
| Series | MC9S08QD4 | — |
| Status Lingkungan Hidup | End of Life (per NXP product page) | — |
| Core | — | HCS08 |
| Instruction Set Architecture | — | CISC (68 HC08 with added BGND) |
| Core Width | — | 8-bit |
| Maximum CPU Frequency | — | 16 MHz |
| Program Memory Type | — | Flash |
| Program Memory Size | — | 4 KB (4K x 8) |
| Packaging | — | Tape & Reel (TR) |
| I/O Pins | — | 4 |
| ADC | — | 10-bit, 4-channel with internal bandgap/temperature sensor, hardware triggerable via RTI |
| Timers | — | TIM1 - 2-channel (input capture / output compare / buffered edge- or center-aligned PWM) |
| Debug | — | Background Debug Mode (BDM); single breakpoint + two additional on-chip breakpoints |
| Status RoHS | — | Compliant |