MC9S08QD4VSC vs S9S08QD4J2MSCR 比較
詳細並排比較 MC9S08QD4VSC 由 NXP Semiconductors 與 S9S08QD4J2MSCR 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | MC9S08QD4VSC | S9S08QD4J2MSCR |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | 停產終止 | 啟用中 |
| Core Processor | S08 (HCS08) | — |
| Core Size | 8-bit | — |
| 最大時脈頻率 | 16 MHz (bus up to 8 MHz per FindIC; 20 MHz CPU capable per datasheet) | — |
| Flash Memory | 4 KB (4K x 8) | — |
| RAM | 256 B | — |
| ADC Resolution | 10-bit | — |
| ADC Channels | 4 | — |
| GPIO Count | 6 | — |
| Instruction Set | CISC (HC08 with added BGND instruction) | — |
| Debug Interface | Background Debug Mode (BDM), single breakpoint on-chip | — |
| 封裝 | 8-SOIC | 8-SOIC (0.154 inch, 3.90 mm width) |
| 安裝類型 | Surface Mount | Surface Mount |
| 工作溫度 | [DATA_NEEDED: operating temperature range] | -40 C to +125 C |
| 供應電壓 | [DATA_NEEDED: supply voltage range] | 2.7 V to 5.5 V |
| Series | MC9S08QD4 | — |
| 生命週期狀態 | End of Life (per NXP product page) | — |
| Core | — | HCS08 |
| Instruction Set Architecture | — | CISC (68 HC08 with added BGND) |
| Core Width | — | 8-bit |
| Maximum CPU Frequency | — | 16 MHz |
| Program Memory Type | — | Flash |
| Program Memory Size | — | 4 KB (4K x 8) |
| Packaging | — | Tape & Reel (TR) |
| I/O Pins | — | 4 |
| ADC | — | 10-bit, 4-channel with internal bandgap/temperature sensor, hardware triggerable via RTI |
| Timers | — | TIM1 - 2-channel (input capture / output compare / buffered edge- or center-aligned PWM) |
| Debug | — | Background Debug Mode (BDM); single breakpoint + two additional on-chip breakpoints |
| RoHS 狀態 | — | Compliant |