MC9S08QD4VSC vs S9S08QD4J2MSCR Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng MC9S08QD4VSC sa pamamagitan ng NXP Semiconductors at S9S08QD4J2MSCR sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

NXP Semiconductors
MC9S08QD4VSC MC9S08QD4VSC - 8-bit S08 MCU 4KB Flash SOIC-8 | NXP

MC9S08QD4VSC - 8-bit S08 MCU 4KB Flash SOIC-8 | NXP

MC9S08QD4VSC ✗ Tapus ng Buhay
NXP Semiconductors
S9S08QD4J2MSCR S9S08QD4J2MSCR - 8-bit 16MHz 4KB Flash MCU | NXP

S9S08QD4J2MSCR - 8-bit 16MHz 4KB Flash MCU | NXP

S9S08QD4J2MSCR ✓ Nakahanda

Pagsanggunian na paghahambing

Parametro MC9S08QD4VSC S9S08QD4J2MSCR
Brand NXP Semiconductors NXP Semiconductors
Kategorya Microcontrollers Microcontrollers
Katayuan ng Lifecycle Tapus ng Buhay Aktibo
Core Processor S08 (HCS08) —
Core Size 8-bit —
Maksimum na Taktiko ng Oras 16 MHz (bus up to 8 MHz per FindIC; 20 MHz CPU capable per datasheet) —
Flash Memory 4 KB (4K x 8) —
RAM 256 B —
ADC Resolution 10-bit —
ADC Channels 4 —
GPIO Count 6 —
Instruction Set CISC (HC08 with added BGND instruction) —
Debug Interface Background Debug Mode (BDM), single breakpoint on-chip —
Packhaging 8-SOIC 8-SOIC (0.154 inch, 3.90 mm width)
Uri ng Pagpapasok Surface Mount Surface Mount
Temperature na Operasyon [DATA_NEEDED: operating temperature range] -40 C to +125 C
Volte ng Pagbibigay [DATA_NEEDED: supply voltage range] 2.7 V to 5.5 V
Series MC9S08QD4 —
Katayuan ng Lifecycle End of Life (per NXP product page) —
Core — HCS08
Instruction Set Architecture — CISC (68 HC08 with added BGND)
Core Width — 8-bit
Maximum CPU Frequency — 16 MHz
Program Memory Type — Flash
Program Memory Size — 4 KB (4K x 8)
Packaging — Tape & Reel (TR)
I/O Pins — 4
ADC — 10-bit, 4-channel with internal bandgap/temperature sensor, hardware triggerable via RTI
Timers — TIM1 - 2-channel (input capture / output compare / buffered edge- or center-aligned PWM)
Debug — Background Debug Mode (BDM); single breakpoint + two additional on-chip breakpoints
Tindminan RoHS — Compliant

Mga Datasheets at Resources

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