MC9S12D64MPVE vs MC9S12DT256CPVE Perbandingan

Perbandingan bersamaan detil MC9S12D64MPVE dari NXP Semiconductors dan MC9S12DT256CPVE dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

NXP Semiconductors
MC9S12DT256CPVE MC9S12DT256CPVE - 16-bit HCS12 MCU 256KB Flash | NXP LQFP-112

MC9S12DT256CPVE - 16-bit HCS12 MCU 256KB Flash | NXP LQFP-112

MC9S12DT256CPVE Nrnd

Perbandingan Spesifikasi

Parameter Umum MC9S12D64MPVE MC9S12DT256CPVE
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup NRND NRND
Core HCS12 (16-bit CISC) —
Maximum CPU Frequency 25 MHz —
Program Memory Type Flash —
Program Memory Size 64 KB (64K x 8) 256 KB (256K x 8) Flash
RAM Size 4 KB 12 KB
Number of I/O 91 —
Paket / Case 112-LQFP (20 x 20 mm) —
Oscillator Type Internal —
Tegangan Pemuat Kerja 2.5 V / 5 V —
ADC Two 8-channel, 10-bit 2x 8-channel, 10-bit
PWM Channels 8 8 channels
Timers 8-channel IC/OC enhanced capture timer 8-channel Enhanced Capture Timer (ECT)
Serial Interfaces 2x SCI (asynchronous) —
I2C (Inter-IC Bus) Yes —
Tipe Mounting Surface Mount Surface Mount
Packaging Tray —
Status RoHS Compliant [DATA_NEEDED: RoHS status from manufacturer]
Core Processor — HCS12 (CPU12 CISC)
Core Size — 16-bit
Frekuensi Bawah Maximum — 25 MHz
EEPROM Size — 4 KB
Lebar Bus Data — 16-bit
Tegangan Pemuat — 2.35 V to 2.75 V (core), 5 V I/O tolerant typical
Number of I/O Pins — 91
Connectivity — CAN, I2C, SCI (UART), SPI
Paket — 112-pin LQFP (20x20 mm)
Suhu Kerja — -40C to +85C (industrial, per 'P' suffix family)
Debug Interface — BDM (Background Debug Mode)
Watchdog — COP (Computer Operating Properly) watchdog

Spek dan Sumber

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