MC9S12D64MPVE vs MC9S12DT256CPVE 比較

詳細並排比較 MC9S12D64MPVE 由 NXP Semiconductors 與 MC9S12DT256CPVE 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MC9S12DT256CPVE MC9S12DT256CPVE - 16-bit HCS12 MCU 256KB Flash | NXP LQFP-112

MC9S12DT256CPVE - 16-bit HCS12 MCU 256KB Flash | NXP LQFP-112

MC9S12DT256CPVE Nrnd

規格比較

參數 MC9S12D64MPVE MC9S12DT256CPVE
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 NRND NRND
Core HCS12 (16-bit CISC) —
Maximum CPU Frequency 25 MHz —
Program Memory Type Flash —
Program Memory Size 64 KB (64K x 8) 256 KB (256K x 8) Flash
RAM Size 4 KB 12 KB
Number of I/O 91 —
封裝 / 外殼 112-LQFP (20 x 20 mm) —
Oscillator Type Internal —
工作電源電壓 2.5 V / 5 V —
ADC Two 8-channel, 10-bit 2x 8-channel, 10-bit
PWM Channels 8 8 channels
Timers 8-channel IC/OC enhanced capture timer 8-channel Enhanced Capture Timer (ECT)
Serial Interfaces 2x SCI (asynchronous) —
I2C (Inter-IC Bus) Yes —
安裝類型 Surface Mount Surface Mount
Packaging Tray —
RoHS 狀態 Compliant [DATA_NEEDED: RoHS status from manufacturer]
Core Processor — HCS12 (CPU12 CISC)
Core Size — 16-bit
最大時脈頻率 — 25 MHz
EEPROM Size — 4 KB
資料匯流排寬度 — 16-bit
供應電壓 — 2.35 V to 2.75 V (core), 5 V I/O tolerant typical
Number of I/O Pins — 91
Connectivity — CAN, I2C, SCI (UART), SPI
封裝 — 112-pin LQFP (20x20 mm)
工作溫度 — -40C to +85C (industrial, per 'P' suffix family)
Debug Interface — BDM (Background Debug Mode)
Watchdog — COP (Computer Operating Properly) watchdog

資料表與資源

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