MC9S12D64MPVE vs MC9S12DT256CPVE Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci MC9S12D64MPVE disebabkan oleh NXP Semiconductors dan MC9S12DT256CPVE disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

NXP Semiconductors
MC9S12DT256CPVE MC9S12DT256CPVE - 16-bit HCS12 MCU 256KB Flash | NXP LQFP-112

MC9S12DT256CPVE - 16-bit HCS12 MCU 256KB Flash | NXP LQFP-112

MC9S12DT256CPVE Nrnd

Pengandingan Spesifikasi

Parametr MC9S12D64MPVE MC9S12DT256CPVE
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup NRND NRND
Core HCS12 (16-bit CISC) —
Maximum CPU Frequency 25 MHz —
Program Memory Type Flash —
Program Memory Size 64 KB (64K x 8) 256 KB (256K x 8) Flash
RAM Size 4 KB 12 KB
Number of I/O 91 —
Kemasan / Case 112-LQFP (20 x 20 mm) —
Oscillator Type Internal —
Tegangan Pemberi Arus Operasi 2.5 V / 5 V —
ADC Two 8-channel, 10-bit 2x 8-channel, 10-bit
PWM Channels 8 8 channels
Timers 8-channel IC/OC enhanced capture timer 8-channel Enhanced Capture Timer (ECT)
Serial Interfaces 2x SCI (asynchronous) —
I2C (Inter-IC Bus) Yes —
Jenis Pemasangan Surface Mount Surface Mount
Packaging Tray —
Status RoHS Compliant [DATA_NEEDED: RoHS status from manufacturer]
Core Processor — HCS12 (CPU12 CISC)
Core Size — 16-bit
Frekuensi Klock Maksimum — 25 MHz
EEPROM Size — 4 KB
Lebar Bus Data — 16-bit
Tegangan Pemberi Arus — 2.35 V to 2.75 V (core), 5 V I/O tolerant typical
Number of I/O Pins — 91
Connectivity — CAN, I2C, SCI (UART), SPI
Kemasan — 112-pin LQFP (20x20 mm)
Suhu Operasi — -40C to +85C (industrial, per 'P' suffix family)
Debug Interface — BDM (Background Debug Mode)
Watchdog — COP (Computer Operating Properly) watchdog

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