MCF5251CVM140 vs MCF5253CVM140 Perbandingan

Perbandingan bersamaan detil MCF5251CVM140 dari NXP Semiconductors dan MCF5253CVM140 dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

NXP Semiconductors
MCF5251CVM140 MCF5251CVM140 - ColdFire V2 140MHz MPU, USB-OTG, 225-MAPBGA | NXP

MCF5251CVM140 - ColdFire V2 140MHz MPU, USB-OTG, 225-MAPBGA | NXP

MCF5251CVM140 ⚠ Waktu Beli Terakhir
NXP Semiconductors
MCF5253CVM140 MCF5253CVM140 - ColdFire V2 32-bit 140MHz MCU | NXP

MCF5253CVM140 - ColdFire V2 32-bit 140MHz MCU | NXP

MCF5253CVM140 ✗ Akhir Hidup

Perbandingan Spesifikasi

Parameter Umum MCF5251CVM140 MCF5253CVM140
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup Waktu Pembelian Terakhir Akhir Hidup
Core Architecture ColdFire V2 (32-bit) —
Maximum Core Frequency 140 MHz —
Core Type 32-Bit MPU —
Program Memory Type ROMless (external flash required) ROMless (external memory)
Paket 225-MAPBGA (13x13 mm, also described as 225-LFBGA) —
Operating Voltage [DATA_NEEDED: core/IO voltage range] —
USB Interface USB-OTG with integrated PHY (Host + Function) —
Enhanced MAC (eMAC) Yes - hardware multiply-accumulator —
Real-Time Clock Yes - tamper-proof RTC —
Ethernet 10/100 MAC (on selected family members) —
External Bus Interface 32-bit with SDRAM controller and chip-select logic —
Rentang Suhu Kerja -40C to +85C (industrial, inferred from CVM suffix) —
Tipe Mounting Surface Mount (BGA) Surface Mount
Level MSL [DATA_NEEDED: MSL rating per JEDEC J-STD-020] —
Status RoHS [DATA_NEEDED: confirm RoHS declaration] [DATA_NEEDED: RoHS status]
Lead-Free [DATA_NEEDED: confirm lead-free] —
Core Processor — ColdFire V2 (MCF525x)
Core Size — 32-Bit
Speed — 140 MHz
RAM Size — 128K x 8
Oscillator Type — External
Connectivity — USB-OTG
Peripherals — eMAC, tamper-proof RTC, USB-OTG
Tegangan Pemuat — 3.3 V
Paket / Case — 225-LFBGA (225-MAPBGA, 13x13 mm)
Architecture — RISC, enhanced multiplier-accumulator (eMAC)
Application Target — Consumer / Industrial (audio decode, file management, system control)
Supplier Device Package — 225-MAPBGA
Status Lingkungan Hidup — End of Life (per NXP product page)
Suhu Kerja — [DATA_NEEDED: operating temperature range]

Spek dan Sumber

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