MCF5251CVM140 vs MCF5253CVM140 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MCF5251CVM140 disebabkan oleh NXP Semiconductors dan MCF5253CVM140 disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
MCF5251CVM140 - ColdFire V2 140MHz MPU, USB-OTG, 225-MAPBGA | NXP
MCF5251CVM140 ⚠ Bahagian terakhir untuk beli
Pengandingan Spesifikasi
| Parametr | MCF5251CVM140 | MCF5253CVM140 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Akhir Hidup |
| Core Architecture | ColdFire V2 (32-bit) | — |
| Maximum Core Frequency | 140 MHz | — |
| Core Type | 32-Bit MPU | — |
| Program Memory Type | ROMless (external flash required) | ROMless (external memory) |
| Kemasan | 225-MAPBGA (13x13 mm, also described as 225-LFBGA) | — |
| Operating Voltage | [DATA_NEEDED: core/IO voltage range] | — |
| USB Interface | USB-OTG with integrated PHY (Host + Function) | — |
| Enhanced MAC (eMAC) | Yes - hardware multiply-accumulator | — |
| Real-Time Clock | Yes - tamper-proof RTC | — |
| Ethernet | 10/100 MAC (on selected family members) | — |
| External Bus Interface | 32-bit with SDRAM controller and chip-select logic | — |
| Gambaran Suhu Operasi | -40C to +85C (industrial, inferred from CVM suffix) | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Aras MSL | [DATA_NEEDED: MSL rating per JEDEC J-STD-020] | — |
| Status RoHS | [DATA_NEEDED: confirm RoHS declaration] | [DATA_NEEDED: RoHS status] |
| Lead-Free | [DATA_NEEDED: confirm lead-free] | — |
| Core Processor | — | ColdFire V2 (MCF525x) |
| Core Size | — | 32-Bit |
| Speed | — | 140 MHz |
| RAM Size | — | 128K x 8 |
| Oscillator Type | — | External |
| Connectivity | — | USB-OTG |
| Peripherals | — | eMAC, tamper-proof RTC, USB-OTG |
| Tegangan Pemberi Arus | — | 3.3 V |
| Kemasan / Case | — | 225-LFBGA (225-MAPBGA, 13x13 mm) |
| Architecture | — | RISC, enhanced multiplier-accumulator (eMAC) |
| Application Target | — | Consumer / Industrial (audio decode, file management, system control) |
| Supplier Device Package | — | 225-MAPBGA |
| Status Lingkungan Hidup | — | End of Life (per NXP product page) |
| Suhu Operasi | — | [DATA_NEEDED: operating temperature range] |