MPC8541EPXALF vs MPC8541EPXAJD Perbandingan
Perbandingan bersamaan detil MPC8541EPXALF dari NXP Semiconductors dan MPC8541EPXAJD dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MPC8541EPXALF - PowerQUICC III e500 MPU 667MHz 783-FCPBGA | NXP
MPC8541EPXALF ⚠ Waktu Beli Terakhir
Perbandingan Spesifikasi
| Parameter Umum | MPC8541EPXALF | MPC8541EPXAJD |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Waktu Pembelian Terakhir | NRND |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Series | PowerQUICC III (MPC85xx) | MPC85xx (PowerQUICC III) |
| Core Architecture | PowerPC e500, 32-bit | PowerPC e500 |
| Lebar Bus Data | 64-bit | 32-bit |
| Core Frequency | 667 MHz | — |
| Tegangan Pemuat | 1.2 V (core); 2.5 V / 3.3 V (I/O) | — |
| Suhu Kerja | 0C to +105C | — |
| Package Type | FCBGA-783 (29 x 29 mm, 1 mm pitch, Flip-Chip) | — |
| Jumlah Pin | 783 | — |
| L1 Cache | 32 KB instruction + 32 KB data | — |
| L2 Cache | 256 KB unified with ECC | — |
| Ethernet Controllers | 3 x eTSEC (10/100/1000 Mbps) | — |
| Memory Controller | 64-bit DDR/DDR2 with ECC | DDR/DDR2 SDRAM |
| Security Engine | SEC 2.0 (DES/3DES/AES/SHA) | — |
| Tipe Mounting | Surface Mount (Flip-Chip BGA) | Surface Mount |
| Status RoHS | Compliant | Compliant (per NXP product page) |
| Lead Free | Yes | — |
| Core Count | — | 1 |
| Maximum Core Frequency | — | 533 MHz |
| Paket | — | 783-FCPBGA (29x29 mm) |
| Terminal Form | — | BALL |
| Number of Terminals | — | 783 |
| Package Code | — | HBGA |
| Ethernet | — | Dual 10/100/1000 Mbps (TSEC) |
| PCI/PCI-X | — | Dual PCI/PCI-X interface |
| Security Engine (SEC) | — | Integrated crypto accelerator |
| Operating Temperature Grade | — | OTHER (extended) |